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Inventor: Shimizu; Kazumichi
Address: Toyonaka, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7355126 |
Electronic parts packaging method and electronic parts package |
April 8, 2008 |
| An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta |
| 7060528 |
Method for mounting a semiconductor element to an interposer by compression bonding |
June 13, 2006 |
| A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, |
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