Resources Contact Us Home
Shimizu; Kazumichi
Toyonaka, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7355126 Electronic parts packaging method and electronic parts package April 8, 2008
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta
7060528 Method for mounting a semiconductor element to an interposer by compression bonding June 13, 2006
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin,

  Recently Added Patents
Disk-based storage device having read channel memory that is selectively accessible to disk controller
Variety corn line LIC7382
Front exterior of an automotive tail lamp
Memory device and semiconductor device
Blur correction device and imaging apparatus
Digital broadcasting transmission and reception system, and a signal processing method using turbo processing and turbo decoding
Multi-protocol data transfers
  Randomly Featured Patents
Tire pressure monitoring device
Apparatus for detecting synchronization
Electrophoretic display
Power converter
Communication apparatus, method for controlling communication apparatus, communication system, program and medium
Scalable audio coding/decoding method and apparatus
Chamber effluent monitoring system and semiconductor processing system comprising absorption spectroscopy measurement system, and methods of use
Bird perch
Apparatus and methods for making differentially-conditioned package pairs
Pressure assist toilet