Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Shimizu; Kazumichi
Address:
Toyonaka, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7355126 Electronic parts packaging method and electronic parts package April 8, 2008
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta
7060528 Method for mounting a semiconductor element to an interposer by compression bonding June 13, 2006
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin,










 
 
  Recently Added Patents
Method and system for dynamic storage tiering using allocate-on-write snapshots
Method for switching between virtualized and non-virtualized system operation
Vehicle display system or projection display for a motor vehicle, and calibration method
Method and device for generating low-jitter clock
Managing distributed applications using structural diagrams
Performance apparatus, a method of controlling the performance apparatus and a program recording medium
Communication terminal, communication system, server apparatus, and communication connecting method
  Randomly Featured Patents
Flower-like bathing implement
Composition for the treatment and prevention of endothelial dysfunction
Coding apparatus and method, decoding apparatus and method, and program storage medium
Machine for seam welding laps of weldable lengths of covering
Indicating when clickable image link on a hypertext image map of a computer web browser has been traversed
Decorative laminated plastic/metal panels
Gaming device having outcomes which replicate the laws of physics
Large integrated circuit with modulator probe structures
Document transport track drive mechanism
Adapting portable electrical devices to receive power wirelessly