Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Shimizu; Kazumichi
Address:
Toyonaka, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7355126 Electronic parts packaging method and electronic parts package April 8, 2008
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta
7060528 Method for mounting a semiconductor element to an interposer by compression bonding June 13, 2006
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin,










 
 
  Recently Added Patents
Isolated Australian coral reef fluorescent proteins and cell-based kinase or phosphatase platforms for cancer drug development
Interest point detection
Grid computing accounting and statistics management system
Stable file system
Systems and methods for identifying malicious domains using internet-wide DNS lookup patterns
Composition for enhancing memory and mitigating neurodegeneration and method thereof
5-HT.sub.3 receptor modulators, methods of making, and use thereof
  Randomly Featured Patents
Methods and apparatus for performing a write/load cache protocol
Acoustic drum with electronic trigger sensor
Rotary seat for vehicle
Refrigerant hose
Substituted diaza-spiro-[5.5]-undecane derivatives and their use as neurokinin antagonists
System for circulatory blood flow travel time determination
Mobile suspension scaffold system
Optical device comprising an optical component and an optical medium with different refractive indices
Hologram recording material, process for producing the same and hologram recording medium
Dosing device on a filling plant, in particular for liquid and pasty products, and process for its operation