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Shimizu; Kazumichi
Toyonaka, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7355126 Electronic parts packaging method and electronic parts package April 8, 2008
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta
7060528 Method for mounting a semiconductor element to an interposer by compression bonding June 13, 2006
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin,

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