Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Shimizu; Kazumichi
Address:
Toyonaka, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7355126 Electronic parts packaging method and electronic parts package April 8, 2008
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical conta
7060528 Method for mounting a semiconductor element to an interposer by compression bonding June 13, 2006
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin,










 
 
  Recently Added Patents
Information obtaining and notification, data message forwarding and handover method and access node
Diazeniumdiolated phosphorylcholine polymers for nitric oxide release
Linear book scanner
DMAPN having a low DGN content and a process for preparing DMAPA having a low DGN content
Communication apparatus, and method and program for controlling same
Organic light emitting display device and method of manufacturing the same
Systems and methods for detecting and rejecting defective absorbent articles from a converting line
  Randomly Featured Patents
Semiconductor device, carrier, card reader, methods of initializing and checking authenticity
Transmission line pulse transformers
User-interactive system and method for integrating applications
Scratch-resistant optical film having organic particles with highly uniform particle size
Heat-reducing silicone grease composition and semiconductor device using the same
Vehicle disabling device
Method of fabricating a liquid crystal display device, comprising forming a protective film so that one end of the protective film is contacted with one end of the transparent conductive patte
System and method for masking a hardware boot sequence
Generating and displaying spatially offset sub-frames
Decorative egg toy set