| Patent Number |
Title Of Patent |
Date Issued |
| 7263897 |
Three-axis motion table |
September 4, 2007 |
| The present invention aims at providing a three-axis motion table capable of ensuring smooth rotations around three rotation axes orthogonal to each other and decreasing an overall weight.The three-axis motion table according to the present invention has an outside frame (3), an (e.g., |
| 7106426 |
Method of inspecting optical waveguide substrate for optical conduction at increased speed and a |
September 12, 2006 |
| There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning opt |
| 6999643 |
Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board |
February 14, 2006 |
| After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for remo |
| 6949815 |
Semiconductor device with decoupling capacitors mounted on conductors |
September 27, 2005 |
| A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via |
| 6934429 |
Optical waveguide board and optical module |
August 23, 2005 |
| An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to |
| 6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip |
August 9, 2005 |
| Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with |
| 6889886 |
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
May 10, 2005 |
| Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with |
| 6829079 |
Optical path control apparatus with mirror section, and manufacturing method for the same |
December 7, 2004 |
| An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror |
| 6703705 |
Semiconductor device and method for packaging same |
March 9, 2004 |
| A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via |
| 6670699 |
Semiconductor device packaging structure |
December 30, 2003 |
| A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat |
| 6524905 |
Semiconductor device, and thin film capacitor |
February 25, 2003 |
| A semiconductor device provided with a thin film capacitor having a small equivalent series inductance is provided, which can be operated at a high frequency range and contributes to size reduction of the electronic devices. The semiconductor device comprises a device formed on a silicon |
| 6515324 |
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, an |
February 4, 2003 |
| A capacitor has a lower electrode, a dielectric thin film, an upper electrode, and an insulation cover layer formed on an insulation substrate made of an organic film or a ceramic material, and through holes formed at positions corresponding to input and output pads of a semiconductor |
| 6486540 |
Three-dimensional semiconductor device and method of manufacturing the same |
November 26, 2002 |
| A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surf |
| 6477284 |
Photo-electric combined substrate, optical waveguide and manufacturing process therefor |
November 5, 2002 |
| The present invention provides a photo-electric combined substrate comprising an electric interconnection part having an electric interconnection layer and an electric insulating layer as well as an optical waveguide part consisting of a core and a clad, where the electric insulating |
| 6430327 |
Optical module and manufacturing method thereof |
August 6, 2002 |
| After an optical element 6, and more preferably both an optical element 6 and an electrical element 7, are mounted on a substrate 1, an upper clad 5 of optical waveguide is formed, covering these elements, and thereby a structure of hermetic seal is achieved through the use of the upper |
| 6422452 |
Method and apparatus for lining up micro-balls |
July 23, 2002 |
| An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a se |
| 6378756 |
Solder ball arrangement device |
April 30, 2002 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 6188127 |
Semiconductor packing stack module and method of producing the same |
February 13, 2001 |
| In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A |
| 6130111 |
Packaged semiconductor device and method of manufacturing the same |
October 10, 2000 |
| A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electro |
| 6111479 |
Laminate printed circuit board with a magnetic layer |
August 29, 2000 |
| A laminate printed circuit board loaded with transistors, ICs (Integrated Circuits) or LSIs (Large Scale Integrated Circuits) and a method of producing the same are disclosed. The circuit board includes a signal layer, a ground layer and a power supply layer sequentially laminated with |
| 6096259 |
Fabrication method of plastic-molded lead component |
August 1, 2000 |
| A fabrication method of a plastic-molded lead component is provided, in which leads are aligned at a fine pitch of approximately 100 .mu.m or less with a high accuracy, a simplified process sequence, and a low cost. First, a template having opened V-grooves is prepared. The V-grooves |
| 6095398 |
Solder ball arrangement device |
August 1, 2000 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 6087597 |
Connecting member and a connecting method with ball and tapered via |
July 11, 2000 |
| An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, |
| 5989484 |
Multilayer glass ceramic substrate and process for producing the same |
November 23, 1999 |
| A multilayer glass ceramic substrate having a plurality of conductor layers each laminated through a glass ceramic layer. The glass ceramic layer has a composition comprising of alumina, borosilicate magnesium glass and cordierite crystal produced by chemical reaction between alumina and |
| 5978231 |
Printed wiring board with integrated coil inductor |
November 2, 1999 |
| An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting |
| 5976965 |
Method for arranging minute metallic balls |
November 2, 1999 |
| A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free |
| 5973392 |
Stacked carrier three-dimensional memory module and semiconductor device using the same |
October 26, 1999 |
| A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the |
| 5952712 |
Packaged semiconductor device and method of manufacturing the same |
September 14, 1999 |
| A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electro |
| 5923535 |
Electronic device assembly |
July 13, 1999 |
| An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and secon |
| 5838064 |
Supporting member for cooling means and electronic package using the same |
November 17, 1998 |
| An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a |
| 5830563 |
Interconnection structures and method of making same |
November 3, 1998 |
| This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of maki |
| 5814882 |
Seal structure for tape carrier package |
September 29, 1998 |
| An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting portions between the inner leads and the pads of the LSI chip are sealed by casting a plastic |
| 5814535 |
Supporting member for cooling means, electronic package and method of making the same |
September 29, 1998 |
| An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower |
| 5793117 |
Semiconductor device and method of fabricating the same |
August 11, 1998 |
| The invention provides a semiconductor device including a semiconductor substrate formed thereon with at least one recessed portion, an electrically conductive layer covering at least a surface of the recessed portion therewith, and a ball-bump formed on the electrically conductive l |
| 5753376 |
Multilayer glass ceramic substrate and process for producing the same |
May 19, 1998 |
| A multilayer glass ceramic substrate having a plurality of conductor layers each laminated through a glass ceramic layer. The glass ceramic layer has a composition comprising of alumina, borosilicate magnesium glass and cordierite crystal produced by chemical reaction between alumina and |
| 5699610 |
Process for connecting electronic devices |
December 23, 1997 |
| In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the |
| 5292574 |
Ceramic substrate having wiring of silver series |
March 8, 1994 |
| A ceramic substrate comprises a ceramic body and a wiring pattern made of silver series selectively formed on the major face of the ceramic body. The ceramic body contains silver particles of 0.1 to 2.5 percents. |
| 5283210 |
Low temperature sintering low dielectric inorganic composition |
February 1, 1994 |
| A low temperature sintering, low dielectric inorganic composition is a ternary inorganic composition comprising cordierite, quartz glass and lead borosilicate glass, wherein if the amounts of the cordierite, quartz glass and lead borosilicate glass are represented by X, Y and Z (wt %) |
| 5283081 |
Process for manufacturing a ceramic wiring substrate having a low dielectric constant |
February 1, 1994 |
| A process for manufacturing a hybrid multilayer ceramic wiring substrate having a low dielectric constant includes a conductor wiring forming step and an insulating layer forming step. The conductor wiring forming step comprises the steps of: applying a photoresist upon a multilayer cera |
| 4724283 |
Multi-layer circuit board having a large heat dissipation |
February 9, 1988 |
| A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic partic |
| 4574255 |
MMC Substrate including capacitors having perovskite structure dielectric and electrical devices |
March 4, 1986 |
| Between insulative layers (31-37, 41-44), a multilayer substrate comprises at least one dielectric layer (26-29). It is possible to form capacitors (58), resistors (46), and wiring conductors (61, 62) in the substrate. The at least one dielectric layer should be of at least one dielectri |
| 4567542 |
Multilayer ceramic substrate with interlayered capacitor |
January 28, 1986 |
| A multilayer ceramic substrate with an interlayered capacitor has a large electrostatic capacity and a high flexural strength, such as 1,500 Kg/cm.sup.2 or more, and yet is manufactured at a relatively low firing or sintering temperature. A first ceramic body includes a plurality of |
| 4536435 |
Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material |
August 20, 1985 |
| A multilayer glass-ceramic substrate comprises insulator layers of a composition consisting essentially of, when components are expressed as oxides in percent by weight, 40-60 percent of aluminum oxide, 1-40 percent of lead oxide, 1-30 percent of boron oxide, 2-40 percent of silicon |
