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Shihoya; Takao
Tokyo, JP
No. of patents:

Patent Number Title Of Patent Date Issued
5580847 Aqueous ammonia composition December 3, 1996
An aqueous ammonia composition having low surface tension is disclosed, which comprises ammonia water and a fluoroalkylsulfonamide compound having the following general formula:wherein R.sup.1 represents a fluoroalkyl group, R.sup.2 represents a hydrogen atom or a lower alkyl group, X re
5326490 Surface tension sulfuric acid composition July 5, 1994
Sulfuric acid or sulfuric acid/hydrogen peroxide cleaning solutions used in semiconductor manufacturing processes are improved in wettability and cleaning effect by lowering their surface tension through the addition of surface-active agents Of the general formula R.sup.1 SO.sub.2 NR.sup

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