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Inventor: Shida; Satoshi
Address: Osaka, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7591409 |
Semiconductor device bonding apparatus and method for bonding semiconductor device using the sam |
September 22, 2009 |
| The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vi |
| 7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet |
June 30, 2009 |
| In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an |
| 6692214 |
Pusher, puller loader, unloader, and working device |
February 17, 2004 |
| A pusher 13 has a leaf spring 12, a driving section 22, a direction changing section 23, and guides 24. The driving section 22 nips the leaf spring to longitudinally advance and retract it. Advancement of a fore end of the leaf spring 12 in a pushing direction causes the object facing th |
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