Resources Contact Us Home
Sherwood; Michael T.
Fremont, CA
No. of patents:

Patent Number Title Of Patent Date Issued
6019670 Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system February 1, 2000
A chemical mechanical polishing apparatus including a carrier head having an integral conditioning member is described. The conditioning member includes a conditioning surface that may selectively be moved into contact with a polishing surface of a polishing pad. The conditioning member
5795215 Method and apparatus for using a retaining ring to control the edge effect August 18, 1998
A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.
5681215 Carrier head design for a chemical mechanical polishing apparatus October 28, 1997
A carrier uses multiple bellows to form two pressure chambers between the housing and carrier base and retaining ring assembly. By pressurizing the first chamber, an even load can be applied across the substrate. By pressurizing the second chamber, the retaining ring can pressed against

  Recently Added Patents
Buckle (tube)
Triple-action pest control formulation and method
Leadless integrated circuit packaging system and method of manufacture thereof
Detecting mirrors on the web
Oxidative coupling of hydrocarbons as heat source
Photomask blank, photomask blank manufacturing method, and photomask manufacturing method
  Randomly Featured Patents
Humidifier system
Anti-theft system for a vehicle, and method for the operation of an anti-theft system
Optical gate device, manufacturing method for the device, and system including the device
Folded type portable radio communication apparatus with functionality
Aluminum reflector with composite reflectivity-enhancing surface layer
Wild bird feeder
Thin film resonant microbeam absolute pressure sensor
Stable hypoxia inducible factor-1.alpha. and method of use
Driving method for solid-state image pickup device
Resin composition curable with an active energy ray containing half-esterificated epoxy resin as a constituent