Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Shapiro; Andrew A.
Address:
Orange, CA
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
5661647 Low temperature co-fired ceramic UHF/VHF power converters August 26, 1997
Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of
5604673 Low temperature co-fired ceramic substrates for power converters February 18, 1997
Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semicon
5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, July 2, 1996
A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20)
5312674 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, May 17, 1994
A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20)
5164699 Via resistors within-multi-layer, 3 dimensional structures substrates November 17, 1992
Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predeter
5055966 Via capacitors within multi-layer, 3 dimensional structures/substrates October 8, 1991
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive ele










 
 
  Recently Added Patents
Mirror drift compensation in an optical circuit switch
Packaging
DRAM refresh method and system
Method for producing lactamates by way of thin film evaporation
Electronic multiparty accounts receivable and accounts payable system
VGPU: a real time GPU emulator
Advertising apparatus
  Randomly Featured Patents
Method and apparatus for service continuity on a mobile communication device
Image sensing apparatus and control method for same, and information processing apparatus, printing apparatus, and print data generation method, using correlation information recorded as attri
Capacity control arrangement for a variable capacity wobble plate type compressor
Systems and methods for code replicating for optimized execution time
Wet mop with self-contained wringer
Process for injection of oxidant and liquid into a well
Method and apparatus for manipulating an ATM cell
Temporary pacing wire package
Wiping tool for cleaning ceiling tile grid structures
Bottle