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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Shapiro; Andrew A.
Address:
Orange, CA
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
5661647 Low temperature co-fired ceramic UHF/VHF power converters August 26, 1997
Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of
5604673 Low temperature co-fired ceramic substrates for power converters February 18, 1997
Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semicon
5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, July 2, 1996
A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20)
5312674 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, May 17, 1994
A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20)
5164699 Via resistors within-multi-layer, 3 dimensional structures substrates November 17, 1992
Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predeter
5055966 Via capacitors within multi-layer, 3 dimensional structures/substrates October 8, 1991
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive ele










 
 
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