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Inventor:
Shannon; Steven C.
Address:
San Mateo, CA
No. of patents:
12
Patents:




Patent Number Title Of Patent Date Issued
7620511 Method for determining plasma characteristics November 17, 2009
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of current and voltage information for first and second waveforms coupled to a plasma at different frequencies, determining
7585384 Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor September 8, 2009
An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thicknes
7554334 Matching network characterization using variable impedance analysis June 30, 2009
Embodiments of a method of calculating the equivalent series resistance of a matching network using variable impedance analysis and matching networks analyzed using the same are provided herein. In one embodiment, a method of calculating the equivalent series resistance of a matching
7510665 Plasma generation and control using dual frequency RF signals March 31, 2009
A method for controlling a plasma in a semiconductor substrate processing chamber is provided. The method includes the steps of supplying a first RF signal to a first electrode within the processing chamber at a first frequency selected to cause plasma sheath oscillation at the first
7440859 Method for determining plasma characteristics October 21, 2008
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of a plasma at two different frequencies, and determining at least one characteristic of the plasma utilizing the metri
7431857 Plasma generation and control using a dual frequency RF source October 7, 2008
A method and apparatus for generating and controlling a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method includes the steps of supplying a first RF signal from the source to an electrode within the processing chamber at a
7375947 Method of feedback control of ESC voltage using wafer voltage measurement at the bias supply out May 20, 2008
In a plasma reactor having an electrostatic chuck, wafer voltage is determined from RF measurements at the bias input using previously determined constants based upon transmission line properties of the bias input, and this wafer voltage is used to accurately control the DC wafer cla
7359177 Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage m April 15, 2008
A plasma reactor has a dual frequency plasma RF bias power supply furnishing RF bias power comprising first and second frequency components, f(1), f(2), respectively, and an RF power path having an input end coupled to the plasma RF bias power supply and an output end coupled to the
7326872 Multi-frequency dynamic dummy load and method for testing plasma reactor multi-frequency impedan February 5, 2008
In one implementation, a method is provided for testing a plasma reactor multi-frequency matching network comprised of multiple matching networks, each of the multiple matching networks having an associated RF power source and being tunable within a tunespace. The method includes pro
7286948 Method for determining plasma characteristics October 23, 2007
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of current and voltage information for first and second waveforms coupled to a plasma at different frequencies, determining
6879870 Method and apparatus for routing harmonics in a plasma to ground within a plasma enhanced semico April 12, 2005
A method and apparatus for routing harmonic energy within a plasma to ground in a plasma enhanced semiconductor wafer processing reactor. A model of the chamber is used to determine the pathway for RF power and the harmonic energy of that RF power through the chamber. From this model, th
6652712 Inductive antenna for a plasma reactor producing reduced fluorine dissociation November 25, 2003
An inductive antenna of a plasma reactor for processing a semiconductor wafer is connected to a radio frequency (RF) power source, and consists of a conductor arranged in successive loops that wind in opposing directions, adjacent pairs of the successive loops having facing portions in w


 
 
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