| Patent Number |
Title Of Patent |
Date Issued |
| 6798070 |
Electronic device assembly and a method of connecting electronic devices constituting the same |
September 28, 2004 |
| An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time |
| 6625883 |
Method for making a bump structure |
September 30, 2003 |
| Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a |
| 6576499 |
Electronic device assembly and a method of connecting electronic devices constituting the same |
June 10, 2003 |
| An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time |
| 6486540 |
Three-dimensional semiconductor device and method of manufacturing the same |
November 26, 2002 |
| A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surf |
| 6422452 |
Method and apparatus for lining up micro-balls |
July 23, 2002 |
| An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a se |
| 6378756 |
Solder ball arrangement device |
April 30, 2002 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 6313533 |
Function element, substrate for mounting function element thereon, and method of connecting them |
November 6, 2001 |
| There is provided a function element including a resin layer formed on a surface thereof, the resin layer having adhesive property and sealing property, the resin layer having such a pattern that a resin layer does not exist in at least one of following areas: (a) a first area around an |
| 6307392 |
Probe card and method of forming a probe card |
October 23, 2001 |
| One main surface of a substrate has formed on it an appropriate contact terminal having in one part thereof a protruding part. An end of a lead is mounted via a holding part that is provided between the substrate and a probe, the lead being disposed along the main surface of the substrat |
| 6307159 |
Bump structure and method for making the same |
October 23, 2001 |
| Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a |
| 6194787 |
Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier |
February 27, 2001 |
| The present invention adopts a circuit pattern in which in a carrier of a package for coupling semiconductor devices at multistage, drawing out lines for selecting individual semiconductor devices are coupled in parallel. Thus, the present invention achieves the multistage coupling s |
| 6191482 |
Semiconductor chip carrier having partially buried conductive pattern and semiconductor device u |
February 20, 2001 |
| A semiconductor chip is mounted on a semiconductor chip carrier through a flip chip bonding technique; the semiconductor chip carrier includes an insulating layer such as synthetic resin having a mounting area assigned to the semiconductor chip and a conductive pattern having pads bonded |
| 6188127 |
Semiconductor packing stack module and method of producing the same |
February 13, 2001 |
| In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A |
| 6114864 |
Probe card with plural probe tips on a unitary flexible tongue |
September 5, 2000 |
| A probe card comprises the following elements. An insulation film is provided which is flexible and extends on a first surface of a substrate. The insulation film has a first surface in contact with the first surface of the substrate, to form a space region which is defined between the |
| 6096259 |
Fabrication method of plastic-molded lead component |
August 1, 2000 |
| A fabrication method of a plastic-molded lead component is provided, in which leads are aligned at a fine pitch of approximately 100 .mu.m or less with a high accuracy, a simplified process sequence, and a low cost. First, a template having opened V-grooves is prepared. The V-grooves |
| 6095398 |
Solder ball arrangement device |
August 1, 2000 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 5976965 |
Method for arranging minute metallic balls |
November 2, 1999 |
| A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free |
| 5973392 |
Stacked carrier three-dimensional memory module and semiconductor device using the same |
October 26, 1999 |
| A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the |
| 5883426 |
Stack module |
March 16, 1999 |
| A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, |
| 5793117 |
Semiconductor device and method of fabricating the same |
August 11, 1998 |
| The invention provides a semiconductor device including a semiconductor substrate formed thereon with at least one recessed portion, an electrically conductive layer covering at least a surface of the recessed portion therewith, and a ball-bump formed on the electrically conductive l |
| 5600180 |
Sealing structure for bumps on a semiconductor integrated circuit chip |
February 4, 1997 |
| A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material |
| 5310965 |
Multi-level wiring structure having an organic interlayer insulating film |
May 10, 1994 |
| To perform a stable wire bonding connecting against a multi-level wiring board using an organic material for the interlayer insulating film, a silicon oxide film and organic interlayer insulating films, for example, polyimide layers, and the first to the fourth level wirings, including a |
