| Patent Number |
Title Of Patent |
Date Issued |
| 7596862 |
Method of making a circuitized substrate |
October 6, 2009 |
| A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an |
| 7325299 |
Method of making a circuitized substrate |
February 5, 2008 |
| A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A portion of the conductive layer is removed to form an interim side wall in the conductive layer |
| 7185428 |
Method of making a circuitized substrate |
March 6, 2007 |
| A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at |
| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
August 23, 2005 |
| A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a so |
| 6822332 |
Fine line circuitization |
November 23, 2004 |
| A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at |
| 6586683 |
Printed circuit board with mixed metallurgy pads and method of fabrication |
July 1, 2003 |
| A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a so |
| 6429390 |
Structure and method for forming the same of a printed wiring board having built-in inspection a |
August 6, 2002 |
| A wiring board for mounting an electrical device, which has an array of connectors thereon arranged in a grid pattern, wherein the connectors have at least two levels of criticality of connection to the substrate. The substrate has a plurality of mounting structure or features arranged i |
| 5189261 |
Electrical and/or thermal interconnections and methods for obtaining such |
February 23, 1993 |
| Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and i |
