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Inventor:
Seidemann; Volker
Address:
Berlin, DE
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8119502 Method for packaging components February 21, 2012
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a pla










 
 
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