Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Seidemann; Volker
Address:
Berlin, DE
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8119502 Method for packaging components February 21, 2012
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a pla










 
 
  Recently Added Patents
Hermetically sealed atomic sensor package manufactured with expendable support structure
Apparatus for providing location information of hand-held device and method thereof
Method for fabrication of a semiconductor device and structure
Visual indicator of online backup
Quinoid thiophene organic photoelectric material, preparation method thereof and application thereof
High conductive water-based silver ink
Poloxamer foamable pharmaceutical compositions with active agents and/or therapeutic cells and uses
  Randomly Featured Patents
Method for forming a reduced thickness packaged electronic device
System and method for providing gradient preservation for image processing
Vibration based user input for mobile devices
Riser clamp for pumps for pumping molten metal
Method and apparatus for detecting chemical binding
Method and apparatus for efficient modulo multiplication
Article for measuring lower extremities comprising laminae of both PVC and acrylic
Optical scanner
Method and apparatus for dispensing a rinse solution on a substrate
Network device driver system having communication function and method of operating the system