| Patent Number |
Title Of Patent |
Date Issued |
| 7572709 |
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin f |
August 11, 2009 |
| Some embodiments of the invention include thin film capacitors formed in a package substrate of an integrated circuit package. At least one of the thin film capacitors includes a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrod |
| 7553738 |
Method of fabricating a microelectronic device including embedded thin film capacitor by over-et |
June 30, 2009 |
| A microelectronic device, a method of fabricating the device, and a system including the device. The method includes: providing a substrate including an underlying conductive layer and a polymer build-up layer overlying the underlying conductive layer; providing a passive microelectr |
| 7435675 |
Method of providing a pre-patterned high-k dielectric film |
October 14, 2008 |
| A method of forming a pre-patterned high-k dielectric film onto a support layer. The method includes: providing a support layer; providing a template defining template openings therein exhibiting a pattern that is a mirror image of a pattern of the pre-patterned high-k dielectric film; |
| 7416938 |
Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, |
August 26, 2008 |
| An integrated thin-film capacitor includes a dielectric disposed between a first electrode and a second electrode. The thin-film capacitor includes a dielectric disposed upon the first electrode, and the dielectric exhibits a substantially uniform heat-altered morphology along a line |
