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Inventor: Schroeder; David
Address: Aurora, IL
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7803203 |
Compositions and methods for CMP of semiconductor materials |
September 28, 2010 |
| The invention provides a composition for chemical-mechanical polishing. The composition comprises an abrasive, a first metal rate polishing modifier agent, a second metal rate polishing modifier agent, and a liquid carrier. In one embodiment, the first metal rate polishing modifier a |
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