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Inventor:
Schroeder; David
Address:
Aurora, IL
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7803203 Compositions and methods for CMP of semiconductor materials September 28, 2010
The invention provides a composition for chemical-mechanical polishing. The composition comprises an abrasive, a first metal rate polishing modifier agent, a second metal rate polishing modifier agent, and a liquid carrier. In one embodiment, the first metal rate polishing modifier a










 
 
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