Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Late loading rich media
Fusion of road geometry model information gathered from disparate sources
Mobile communication method, mobile station, and network device
Sealed, waterproof digital electronic camera system and method of fabricating same
Searchlight
Multi-channel memory system including error correction decoder architecture with efficient area utilization
Real ear measurement system using thin tube
  Randomly Featured Patents
Methods and systems for providing an absent addressing service to customers in a communications network
Glass
Methods and apparatus for forming precursors
Bed for snorers
Apparatus for combining signals from first and second information processing elements
Wireless power feeder, light source cartridge, and wireless illumination system
Method of dual EGM sensing and heart rate estimation in implanted cardiac devices
Personnel casualty simulator
Phosphor position in light emitting diodes
Multilevel optical recording arrangement