Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Zero-copy network and file offload for web and application servers
Selection of hash lookup keys for efficient retrieval
Method and system for reduction of quantization-induced block-discontinuities and general purpose audio codec
Fuel cell system, and electric vehicle equipped with the fuel cell system
Receiver and transmitter receiver system
Avalanche photodiodes having accurate and reproductible amplification layer
Distributed IPv6 neighbor discovery for large datacenter switching systems
  Randomly Featured Patents
Strikerless percussion musical instrument
Peach tree named `Galactica`
Composite materials, composite film manufactured by using the same and method for manufacturing composite film
Guide for rotary cutter
Electric shaver
Sutures with notch near needle-suture junction
Method of making printed wiring boards
Method for making humanized antibodies
Disk drive having pivotally mounted shroud
Cabinet lid stay