Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Synthesizing VHDL multiple wait FSMS into RT level FSMS by preprocessing
Data-conditioned encryption method
Liposomal nanoparticles and other formulations of fenretinide for use in therapy and drug delivery
Method for detecting motion of an electrical device or apparatus
Method for controlling operation of a wind turbine
Systems and methods for image stream processing
Image forming apparatus and method of translating virtual memory address into physical memory address
  Randomly Featured Patents
Chair
Rotatable sign with counterweight
Preparation of difluoroacetic acid fluoride and difluoroacetic acid esters
Travel pillow
Refill for an air freshener device
Exercise machine with two-directional pivoting user support
Salts of a glutathione alkylester and anaminoacids
Video signal processor processing video signal by plurality of data driven processors and television receiver using the same
Stabilized iodine tincture
Brake for a kite