Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Method and apparatus for providing charging status information to subscriber of communication service
HSP20 inhibits amyloidogenesis and neurotoxicity
Mass spectrometry device and method using ion-molecule reaction ionization
Scanning optical positioning system with spatially triangulating receivers
Tiered cost model for access to a computer network
Liquid crystal display and manufacturing method thereof
Decontamination apparatus and method
  Randomly Featured Patents
Pneumatic tire including blocks with V-shaped corners
Ventilating device
Stereo-based image processing
Region protection unit, instruction set and method for protecting a memory region
Process for the manufacture of an object displaying a message
Securely persisting network resource identifiers
Tablet of compacted particulated cleaning composition
Dry film multilayer photoresist element
Fabrication process for metal-insulator-metal capacitor with low gate resistance
Carbon micro-sensor electrode and method for preparing it