Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Transfer of digital data through an isolation
Digital photographing apparatus, method of controlling the same, and recording medium for the method
Hybrid CMOS nanowire mesh device and PDSOI device
Triazole derivatives as ghrelin analogue ligands of growth hormone secretagogue receptors
Method and system for enabling rendering of electronic media content via a secure ad hoc network configuration utilizing a handheld wireless communication device
Method of interfacing a host operating through a logical address space with a direct file storage medium
Latch-up free ESD protection
  Randomly Featured Patents
Therapeutic uses of BPI protein products in BPI-deficient humans
Ring shaped digital communication system and method for accessing a message channel in such system
Photoresist composition
Zoom lens and imaging device
Vibration control apparatus having oscillation frequency regulation
Use of N-phenyl-1-naphthylamine as a vaginal contraceptive
Capacitance controlled keyswitch
Chair pad
Snorkel
Corner caddy unit