Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Systems and methods for generating customized user interfaces
Method and system for simulating wireless networks
PLL circuit
Image playback device and method and electronic camera with image playback function
Method for detecting security error in mobile telecommunications system and device of mobile telecommunications
Touch panel structure and manufacturing method thereof
Remote device pairing setup
  Randomly Featured Patents
Motor vehicle control system
Method for selection of primate tumor-associated antigens suitable as in vivo targets for antibodies
TV set
Golf ball retriever
Digital signal processor, error detection method, and recording medium reproducer
Methods for filtering fluids
Process integration of SOI FETs with active layer spacer
Tumble sensors for a saddle ride type all-terrain vehicle
Laser device
Image reading apparatus