Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Satou; Tomio
Address:
Nagoya, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5580432 Jig for electroplating lead pins of an integrated circuit package December 3, 1996
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins
5459102 Method of electroplating lead pins of integrated circuit package October 17, 1995
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins










 
 
  Recently Added Patents
Controlling transmission resources in mobile radio systems with dualtransfer mode
Table base
Electrode and method for manufacturing the same
White light emitting lamp and white LED lighting apparatus including the same
Utility knife
Methods and apparatus for ultrasonic cleaning
Basket for a dishwasher
  Randomly Featured Patents
Boat hull with center V-hull and sponsons
Use of aluminium chloride as a resveratrol synthesis elicitor
Static random access memory and semiconductor device using MOS transistors having channel region electrically connected with gate
`Morning Lord` peach tree
Inverted lead frame in substrate
Process for the production of (meth)allyl phosphonic acid dialkyl esters
Data terminal for storing and reading information on a selected beverage
Tube reactor
Tire tread
Procedure and device for improving the maneuverability of an aircraft during the approach to landing and flare-out phases