| Patent Number |
Title Of Patent |
Date Issued |
| 6577000 |
Premold type semiconductor package |
June 10, 2003 |
| A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at |
| 6333211 |
Process for manufacturing a premold type semiconductor package using support pins in the mold an |
December 25, 2001 |
| A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at |
| 6097101 |
Package for semiconductor device having frame-like molded portion and producing method of the sa |
August 1, 2000 |
| The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 |
| 4969257 |
Transfer sheet and process for making a circuit substrate |
November 13, 1990 |
| A transfer sheet includes an electrodeposited metal foil having a smooth surface and a rough surface attached to a heatproof flexible base sheet. Using such a transfer sheet, a circuit substrate is formed by etching the electrodeposited metal foil to form a circuit pattern, placing the |
| 4867839 |
Process for forming a circuit substrate |
September 19, 1989 |
| A process for forming a circuit substrate comprising placing an electrodeposited metal foil having a rough surface provided with a large number of fine projections in a cavity of a mold in such a manner that the rough surface faces an inside of the mold cavity; pouring a melting resin |
| 4345372 |
Method of producing a multicontact spring |
August 24, 1982 |
| A multicontact spring having a number of contacts per unit width is produced by press working. A metal tape for a spring is blanked to form a blank. The blank is pressed to make linear dents and, then, cutting of each one of the linear dents is performed. The blank having the cut parts |
