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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Saraiya; Mukund K.
Address:
Endwell, NY
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
5632630 Optical module with tolerant wave soldered joints May 27, 1997
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the opti
5604831 Optical module with fluxless laser reflow soldered joints February 18, 1997
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend fro
5295214 Optical module with tolerant wave soldered joints March 15, 1994
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the opti
5243133 Ceramic chip carrier with lead frame or edge clip September 7, 1993
A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized s
4919729 Solder paste for use in a reducing atmosphere April 24, 1990
A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a p










 
 
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