| Patent Number |
Title Of Patent |
Date Issued |
| 5632630 |
Optical module with tolerant wave soldered joints |
May 27, 1997 |
| An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the opti |
| 5604831 |
Optical module with fluxless laser reflow soldered joints |
February 18, 1997 |
| An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend fro |
| 5295214 |
Optical module with tolerant wave soldered joints |
March 15, 1994 |
| An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the opti |
| 5243133 |
Ceramic chip carrier with lead frame or edge clip |
September 7, 1993 |
| A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized s |
| 4919729 |
Solder paste for use in a reducing atmosphere |
April 24, 1990 |
| A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a p |
