| Patent Number |
Title Of Patent |
Date Issued |
| 7216792 |
Self assembled nano-devices using DNA |
May 15, 2007 |
| An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure. |
| 7033648 |
Means of seeding and metallizing polyimide |
April 25, 2006 |
| A method to selectively metallize polyimide with an all-electroless process. |
| 6656693 |
Self assembled nano-devices using DNA |
December 2, 2003 |
| An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure. |
| 6632612 |
Synthesis of chemical tags |
October 14, 2003 |
| A method for forming a biological chemical tag. At least one double stranded DNA molecule is provided. At least a portion of the at least one double stranded DNA molecule is denatured. At least one chemical moiety that prohibits recrystallization of the at least one denatured portion to |
| 6616863 |
Plasticized, antiplasticized and crystalline conducting polymers and precursors thereof |
September 9, 2003 |
| Materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobili |
| 6548843 |
Ferroelectric storage read-write memory |
April 15, 2003 |
| A memory device including at least one pair of spaced apart conductors and a ferroelectric material between the pair of conductors. The pair of conductors is spaced apart a distance sufficient to permit a tunneling current therebetween. |
| 6403321 |
Nano-devices using block-copolymers |
June 11, 2002 |
| A structure including a substrate. A first electrode and a second electrode are arranged spaced apart from each other on the substrate. A polymer string is positioned on the substrate between the two electrodes, the polymer line has a width of less than about 50 nm. |
| 6281105 |
Electrode modification using an unzippable polymer paste |
August 28, 2001 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6221503 |
Electrode modification using an unzippable polymer paste |
April 24, 2001 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6218175 |
Nano-devices using block-copolymers |
April 17, 2001 |
| A structure including a substrate. A first electrode and a second electrode are arranged spaced apart from each other on the substrate. A polymer string is positioned on the substrate between the two electrodes, the polymer line has a width of less than about 50 nm. |
| 6210606 |
Polycrystalline conducting polymers and precursors thereof having adjustable morphology and prop |
April 3, 2001 |
| Polycrystalline materials containing crystallites of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material |
| 6197222 |
Lead free conductive composites for electrical interconnections |
March 6, 2001 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 6174606 |
Corrosion and dissolution protection of a conductive silver/polymer composite |
January 16, 2001 |
| A conductive composite is described containing silver particles and a polymer which covers each silver particle and wherein a heterocyclic organic compound containing nitrogen such as benzotriazole (BTA) is present to reduce Ag dissolution and ion mobility by forming a water insolubl |
| 6127253 |
Lead-free interconnection for electronic devices |
October 3, 2000 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 6099939 |
Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tail |
August 8, 2000 |
| Enhanced adhesion between a vapor deposited metal and an organic polymer surface is achieved without utilizing any intermediate surface preparatory steps. The morphology of the polymer surface is tailored to produce mounds and dimples on the surface which leads to a mechanically tougher, |
| 6015509 |
Composition containing a polymer and conductive filler and use thereof |
January 18, 2000 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 6013713 |
Electrode modification using an unzippable polymer paste |
January 11, 2000 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6005292 |
Lead-free interconnection for electronic devices |
December 21, 1999 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 5997773 |
Method for providing discharge protection or shielding |
December 7, 1999 |
| Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at |
| 5985458 |
Housing for electromagnetic interference shielding |
November 16, 1999 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 5969024 |
Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and prec |
October 19, 1999 |
| Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide |
| 5960251 |
Organic-metallic composite coating for copper surface protection |
September 28, 1999 |
| Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubst |
| 5932143 |
Polycrystalline conducting polymers and precursors thereof having adjustable morphology and phys |
August 3, 1999 |
| Polycrystalline materials containing crystallies of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material c |
| 5928566 |
Plasticized, antiplasticized and crystalline conducting polymers |
July 27, 1999 |
| Materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobili |
| 5922466 |
Composite comprising a metal substrate and a corrosion protecting layer |
July 13, 1999 |
| A composite comprising a metal substrate and as a corrosion protecting layer on at least one major surface of said substrate, a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically |
| 5916486 |
Method for providing discharge protection or shielding |
June 29, 1999 |
| Electrostatic discharge protection and electromagnetic interference shielding is provided by applying to a dielectric substrate a composition comprising a polymeric matrix and a conductive filler component. The conductive filler component comprises electrically conductive metal parti |
| 5897336 |
Direct chip attach for low alpha emission interconnect system |
April 27, 1999 |
| An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resist |
| 5866044 |
Lead free conductive composites for electrical interconnections |
February 2, 1999 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5854514 |
Lead-free interconnection for electronic devices |
December 29, 1998 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 5776587 |
Electronic package comprising a substrate and a semiconductor device bonded thereto |
July 7, 1998 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 5700398 |
Composition containing a polymer and conductive filler and use thereof |
December 23, 1997 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
