| |
|
Inventor: Sanada; Yoshiaki
Address: Kanagawa, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554191 |
Semiconductor device having a heatsink plate with bored portions |
June 30, 2009 |
| A heatsink plate is to be fixed to a substrate with sufficient strength, so as to prevent the heatsink plate from being stripped off, to thereby secure reliability on the performance of the semiconductor chip. The heatsink plate has both the upper and lower surfaces of the fixing sec |
|
|
|
