| Patent Number |
Title Of Patent |
Date Issued |
| 7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating |
December 23, 2008 |
| The idea of the invention is to coat the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring by a 1-20 nm thick metal layer prior to deposition of the interlevel dielectric. This coating is sufficiently thin so as to obviate the need for additional |
| 7081680 |
Self-aligned corrosion stop for copper C4 and wirebond |
July 25, 2006 |
| An electrical structure including a substrate and an interconnect. The substrate includes an electrically conductive and corrosion resistant metallic layer on a metal layer. The interconnect is electrically coupled to the metallic layer. A top surface of the metallic layer is above a top |
| 7033648 |
Means of seeding and metallizing polyimide |
April 25, 2006 |
| A method to selectively metallize polyimide with an all-electroless process. |
| 6779711 |
Self-aligned corrosion stop for copper C4 and wirebond |
August 24, 2004 |
| A self-aligned process for fabricating a corrosion-resistant conductive pad on a substrate, and a structure that includes an interconnect to allow a terminal connection to the pad. The process generates a metallic layer on an initially exposed metal layer. The metallic layer is electrica |
| 6503834 |
Process to increase reliability CuBEOL structures |
January 7, 2003 |
| The invention provides a process to increase the reliability of BEOL interconnects. The process comprises forming an array of conductors on a dielectric layer on a wafer substrate, polishing the upper surface so that the surfaces of the conductors are substantially co-planar with the upp |
| 6457234 |
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond |
October 1, 2002 |
| A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal connection to the conductive pad (e.g., a chip-to-package connection). The conductive |
| 6436803 |
Manufacturing computer systems with fine line circuitized substrates |
August 20, 2002 |
| Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed |
| 6358832 |
Method of forming barrier layers for damascene interconnects |
March 19, 2002 |
| A damascene interconnect containing a dual etch stop/diffusion barrier. The conductive material of the damascene interconnect is capped with a conductive metal diffusion barrier cap, typically using electroless deposition, and, optionally, with a dielectric etch-stop layer. An option |
| 6339024 |
Reinforced integrated circuits |
January 15, 2002 |
| A method of manufacturing integrated circuits wherein a conductive structure in a topmost semiconductive layer of an integrated circuit is provided having a thickness greater than or equal to 1.5 .mu.m. The thickness of the conductive structure is sufficiently great as to effectively |
| 6268016 |
Manufacturing computer systems with fine line circuitized substrates |
July 31, 2001 |
| Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed |
| 6197222 |
Lead free conductive composites for electrical interconnections |
March 6, 2001 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 6153935 |
Dual etch stop/diffusion barrier for damascene interconnects |
November 28, 2000 |
| A damascene interconnect containing a dual etch stop/diffusion barrier. The conductive material of the damascene interconnect is capped with a conductive metal diffusion barrier cap, typically using electroless deposition, and, optionally, with a dielectric etch-stop layer. An option |
| 5866044 |
Lead free conductive composites for electrical interconnections |
February 2, 1999 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5545429 |
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without se |
August 13, 1996 |
| The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to sai |
| 5509557 |
Depositing a conductive metal onto a substrate |
April 23, 1996 |
| A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurfa |
| 5310580 |
Electroless metal adhesion to organic dielectric material with phase separated morphology |
May 10, 1994 |
| Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer |
| 5190463 |
High performance metal cone contact |
March 2, 1993 |
| An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than n |
| 5105537 |
Method for making a detachable electrical contact |
April 21, 1992 |
| An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than n |
| 5079070 |
Repair of open defects in thin film conductors |
January 7, 1992 |
| Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy. |
| 4948707 |
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
August 14, 1990 |
| A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkal |
| 4820643 |
Process for determining the activity of a palladium-tin catalyst |
April 11, 1989 |
| The effectiveness of a palladium-tin catalyst for subsequent plating thereon is determined by employing cyclic voltammetry. |
| 4654126 |
Process for determining the plating activity of an electroless plating bath |
March 31, 1987 |
| A process for monitoring an electroless plating bath to determine whether it is in a take mode by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode; providing the cathode, a reference electrode, and an anode in the electr |
| 4593016 |
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst |
June 3, 1986 |
| A concentrate of a palladium-tin colloidal catalyst is obtained by dissolving stannous chloride in HCl, diluting the solution with HCl and then further diluting the solution with deionized water to thereby obtain a diluted stannous chloride solution. This solution is cooled to room t |
| 4554182 |
Method for conditioning a surface of a dielectric substrate for electroless plating |
November 19, 1985 |
| Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available ca |
| 4534797 |
Method for providing an electroless copper plating bath in the take mode |
August 13, 1985 |
| An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:wherin C is the conce |
| 4525390 |
Deposition of copper from electroless plating compositions |
June 25, 1985 |
| Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ |
| 4478883 |
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a su |
October 23, 1984 |
| A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. |
| 4448804 |
Method for selective electroless plating of copper onto a non-conductive substrate surface |
May 15, 1984 |
| Multistep process for electroless plating of copper onto a non-conductive surface including the steps of: (1) laminating a rough copper sheet onto the non-conductive surface; (2) etching away all the copper; (3) conditioning the surface with multifunctional positively charged molecules |
| 4441938 |
Soldering flux |
April 10, 1984 |
| A soldering flux comprising of rosin, certain acetic acid derivatives, ionic fluorocarbon surfactant, and organic diluent. |
| 4415905 |
Electrolytic printing process with wear resistant electrode |
November 15, 1983 |
| The present invention provides a process for electrolytic printing using an improved electrode. The electrode has a region which is an oxide of a metal from the group of ruthenium, iridium, platinum or an alloy thereof. The oxide region is at the extremity of the electrode which during t |
| 4371273 |
Electrochemical printhead |
February 1, 1983 |
| An electrochromic printhead and a method of construction thereof in which the printhead is fabricated from an array of spaced, precisely positioned, small glass tubes. The array of glass tubes defines an array of cylindrical apertures extending through the printhead to form a printing |
| 4264693 |
Light and current sensitive film and print-display system therewith |
April 28, 1981 |
| Films are disclosed which are constituted essentially of iodides of heavy metals to which catalysts or sensitizing agents are added to make the films highly sensitive to light and current at room temperature, thus increasing the speed of writing and erasing cycles. The disclosure pro |
| 4211616 |
Electrochromic printing system |
July 8, 1980 |
| An improved electrolytic printing fluid is described. The printing fluid is comprised of an agent for the catalyzation of the electro-oxidation of a color forming agent therein. The fluid may include an agent which can form a clathrate complex with the color forming agent, as well as an |
