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Sajot; Nicolas Edgard
Wauwatosa, WI
No. of patents:

Patent Number Title Of Patent Date Issued
8129464 Low application temperature hot melt adhesive March 6, 2012
A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifyin

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