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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Saito; Noriaki
Address:
Tsukuba, JP
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
5560968 Semiconductor device encapsulated with an epoxy resin and a process for encapsulation October 1, 1996
A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carb
5478871 Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same December 26, 1995
The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The
5462997 Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom October 31, 1995
An epoxy resin composition contains (a) an epoxy resin represented by the general formula (2) ##STR1## wherein R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group havin
5395912 Polyhydric phenol and epoxy resin and epoxy resin composition derived therefrom March 7, 1995
There is provided an epoxy resin composition represented by the general formula: ##STR1## wherein R.sub.1 represents an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, R.sub.2 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to










 
 
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