| Patent Number |
Title Of Patent |
Date Issued |
| 7345132 |
Method of producing novolak resin |
March 18, 2008 |
| Provided an industrially excellent method of producing a phenol novolak resin having an ortho ratio of 30% or more by: (1) a method of reacting a phenol and an aldehyde using an oxalic acid catalyst at 110 to 160.degree. C. under pressure; or (2) a method of reacting a phenol and an |
| 6992166 |
Phenolic resin and method of producing the same |
January 31, 2006 |
| A phenolic resin obtainable by reacting a dihydroxy compound of the following formula (1) with a phenolic compound, ##STR00001## wherein the dihydroxy compound is partially dehydrated. |
| 6936680 |
Method of producing novolak resin |
August 30, 2005 |
| Provided an industrially excellent method of producing a phenol novolak resin having an ortho ratio of 30% or more by: (1) a method of reacting a phenol and an aldehyde using an oxalic acid catalyst at 110 to 160.degree. C. under pressure; or (2) a method of reacting a phenol and an alde |
| 6410145 |
Thermosetting resin composition for build-up |
June 25, 2002 |
| Provided are a thermosetting resin composition for build-up method which gives a cured product excellent in heat resistance, an insulating material for build-up method using thereof and a build-up print circuit board. The thermosetting resin composition for build-up method comprises (A) |
| 6306935 |
Thermosetting resin compositions for build-up method |
October 23, 2001 |
| Provided is a thermosetting resin composition for build-up method comprising (A) an epoxy resin having two or more glycidyl groups, (B) a curing agent for epoxy resin, (C) a poly(ether sulfone) and (D) an inorganic filler. The thermosetting resin composition does not deteriorate the |
| 5780145 |
Filler-containing resin composition suitable for injection molding and transfer molding |
July 14, 1998 |
| A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not grea |
| 5719225 |
Filler-containing resin composition suitable for injection molding and transfer molding |
February 17, 1998 |
| A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not grea |
| 5644003 |
Epoxy resin composition, process for producing the same and resin-sealed semiconductor device |
July 1, 1997 |
| An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp |
