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Sahasrabudhe; Kapil Heramb
Dallas, TX
No. of patents:

Patent Number Title Of Patent Date Issued
8102038 Semiconductor chip attach configuration having improved thermal characteristics January 24, 2012
A semiconductor chip 101 with surface 101b free of circuitry assembled on a metal carrier 102 by an attachment layer 103 with thickness 103a. Included in layer 103 are metal bodies 104 and an adhesive polymeric compound 105 between bodies 104. Metal bodies 104 form metal inter-diffus
7838988 Stud bumps as local heat sinks during transient power operations November 23, 2010
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal m
7821113 Leadframe having delamination resistant die pad October 26, 2010
A lead frame (410) including a die pad (100) for mounting at least one integrated circuit (405) thereon and a plurality of lead fingers (413). The die pad (100) includes a metal including substrate (105) having a periphery that includes a plurality of sides (111-114), an intersection

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