| Patent Number |
Title Of Patent |
Date Issued |
| 7602958 |
Mirror node process verification |
October 13, 2009 |
| An inspection image analysis system. At least one image processing computer is configured to receive and analyze at least one portion of an image. At least one test computer is configured to receive at least one common portion of the image also received by the at least one image proc |
| 7555409 |
Daisy chained topology |
June 30, 2009 |
| An inspection system. The inspection system has a sensor for generating data. A first network is coupled to the sensor and communicates the data. An array of nodes is coupled to the first network, and processes the data to produce reports. Each node has an interface coupled to the first |
| 7417724 |
Wafer inspection systems and methods for analyzing inspection data |
August 26, 2008 |
| Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the |
| 7397553 |
Surface scanning |
July 8, 2008 |
| In one embodiment, a surface scanning system comprises a radiation directing assembly that scans a surface using a Cartesian scanning pattern; and a radiation collecting assembly that collects radiation reflected from the surface. A scattered radiation collection system is included t |
| 7379838 |
Programmable image computer |
May 27, 2008 |
| An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for |
| 7324198 |
Edge bead removal inspection by reflectometry |
January 29, 2008 |
| A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster angle of silicon or |
| 7280197 |
Wafer edge inspection apparatus |
October 9, 2007 |
| A wafer edge inspection system utilizes a novel camera and mirror arrangement which conveys the images of the various near-edge wafer regions in piecewise fashion to a linear sensor array on a single line-scan sensor. This system is low-cost and compact, and may be integrated into va |
| 7251586 |
Full swath analysis |
July 31, 2007 |
| An inspection system for detecting anomalies on a substrate. A first network is coupled to the sensor array and communicates image data. Process nodes are couple to the first network, and process the data to produce reports. Each process node has an interface card that formats the da |
| 7227628 |
Wafer inspection systems and methods for analyzing inspection data |
June 5, 2007 |
| Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the |
| 7181368 |
Status polling |
February 20, 2007 |
| An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first h |
| 7176433 |
Resolution enhancement for macro wafer inspection |
February 13, 2007 |
| A method and apparatus for improving system resolution for a defect line scanner while not increasing aliasing effects, or alternatively to maintain system resolution for a defect scanner while decreasing aliasing effects. This is accomplished by decreasing effective pixel size for a |
| 7149642 |
Programmable image computer |
December 12, 2006 |
| An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for |
| 7142300 |
Edge bead removal inspection by reflectometry |
November 28, 2006 |
| A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster angle of silicon or |
| 7076390 |
Memory load balancing |
July 11, 2006 |
| An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node includes memory sufficient to buffer the data un |
| 7072034 |
Systems and methods for inspection of specimen surfaces |
July 4, 2006 |
| Systems and methods for contact image sensor based inspection of specimens are provided. A system configured to inspect a specimen may include a contact image sensor. The contact image sensor may include a light source configured to direct light toward a surface of the specimen and a lin |
| 7024339 |
Full swath analysis |
April 4, 2006 |
| An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates image data. Process nodes are coupled to the first network, and processes the data to produce reports. Each process node has an interface card that formats the data |
| 6796697 |
Illumination delivery system |
September 28, 2004 |
| An illumination delivery system provides a spatially and angularly uniform shaped beam output with sufficient intensity to illuminate a sample surface for defect inspection. Light is transmitted through a shaped fiber optic bundle, a homogenizer, a diffuser, and an optional focusing opti |
| 6791680 |
System and method for inspecting semiconductor wafers |
September 14, 2004 |
| A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being |
| 6020957 |
System and method for inspecting semiconductor wafers |
February 1, 2000 |
| A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being |
| 5653539 |
Method and apparatus for remotely measuring the temperature of a surface |
August 5, 1997 |
| A method and apparatus for measuring the temperature profile of a surface exhibiting spatial and/or temporal variations in temperature, e.g., the surface of a machine or a biological system, is disclosed. The inventive method involves forming a layer of chemiluminescent material in therm |
| 4755874 |
Emission microscopy system |
July 5, 1988 |
| An optical emission microscopy system with a macro optic system having a high numerical aperture for obtaining global views of an integrated circuit Device Under Test (DUT). The DUT is subjected to illumination and stimulation conditions, and images are obtained to form a "global dif |
