| Patent Number |
Title Of Patent |
Date Issued |
| 6281105 |
Electrode modification using an unzippable polymer paste |
August 28, 2001 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6221503 |
Electrode modification using an unzippable polymer paste |
April 24, 2001 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6197222 |
Lead free conductive composites for electrical interconnections |
March 6, 2001 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 6174606 |
Corrosion and dissolution protection of a conductive silver/polymer composite |
January 16, 2001 |
| A conductive composite is described containing silver particles and a polymer which covers each silver particle and wherein a heterocyclic organic compound containing nitrogen such as benzotriazole (BTA) is present to reduce Ag dissolution and ion mobility by forming a water insolubl |
| 6127253 |
Lead-free interconnection for electronic devices |
October 3, 2000 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 6099939 |
Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tail |
August 8, 2000 |
| Enhanced adhesion between a vapor deposited metal and an organic polymer surface is achieved without utilizing any intermediate surface preparatory steps. The morphology of the polymer surface is tailored to produce mounds and dimples on the surface which leads to a mechanically tougher, |
| 6015509 |
Composition containing a polymer and conductive filler and use thereof |
January 18, 2000 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 6013713 |
Electrode modification using an unzippable polymer paste |
January 11, 2000 |
| A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. Th |
| 6005292 |
Lead-free interconnection for electronic devices |
December 21, 1999 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 5997773 |
Method for providing discharge protection or shielding |
December 7, 1999 |
| Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at |
| 5985458 |
Housing for electromagnetic interference shielding |
November 16, 1999 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 5922466 |
Composite comprising a metal substrate and a corrosion protecting layer |
July 13, 1999 |
| A composite comprising a metal substrate and as a corrosion protecting layer on at least one major surface of said substrate, a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically |
| 5916486 |
Method for providing discharge protection or shielding |
June 29, 1999 |
| Electrostatic discharge protection and electromagnetic interference shielding is provided by applying to a dielectric substrate a composition comprising a polymeric matrix and a conductive filler component. The conductive filler component comprises electrically conductive metal parti |
| 5897336 |
Direct chip attach for low alpha emission interconnect system |
April 27, 1999 |
| An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resist |
| 5866044 |
Lead free conductive composites for electrical interconnections |
February 2, 1999 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5854514 |
Lead-free interconnection for electronic devices |
December 29, 1998 |
| An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermopl |
| 5834405 |
Superconducting multilayer ceramic substrate |
November 10, 1998 |
| A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide re |
| 5813870 |
Selectively filled adhesives for semiconductor chip interconnection and encapsulation |
September 29, 1998 |
| Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a |
| 5776587 |
Electronic package comprising a substrate and a semiconductor device bonded thereto |
July 7, 1998 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
| 5700398 |
Composition containing a polymer and conductive filler and use thereof |
December 23, 1997 |
| A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted poly |
