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Inventor: Rogers; Harvey N
Address: Playa Del Rey, CA
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7081411 |
Wafer etching techniques |
July 25, 2006 |
| A method (10) for etching a through via (116, 118) on a wafer (100) of semiconductor material (102), wherein the wafer (100) has a front side surface (110) and a backside surface (106), is described. A layer of photoresist material (104) is applied to the backside surface (106). The |
| 6764573 |
Wafer thinning techniques |
July 20, 2004 |
| Apparatuses (10, 100), and methods of using same, for the simultaneous thinning of the backside surfaces of a plurality of semiconductor wafers (W) using a non-crystallographic and uniform etching process, are described. The apparatuses (10, 100) include a fixture (12, 102) having a |
| 6551905 |
Wafer adhesive for semiconductor dry etch applications |
April 22, 2003 |
| A method is provided for backside processing a semiconductor wafer (10) including applying a polymer based protective coating (16) on the wafer, depositing a barrier layer of ceramic (18) on the protective coating, and coating the ceramic layer with a thermoplastic based adhesive (20). |
| 5981143 |
Chemically treated photoresist for withstanding ion bombarded processing |
November 9, 1999 |
| A photosensitive photoresist material which is effective for use as an ion etch barrier layer after patterning. The photoresist composition includes the reaction product of a compound having the general formula R.sub.1 --COO--(CH.sub.2).sub.n --O--R.sub.2 and a silylating agent. |
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