| Patent Number |
Title Of Patent |
Date Issued |
| 7556089 |
Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant |
July 7, 2009 |
| The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid |
| 7556088 |
Thermosiphon for laptop computer |
July 7, 2009 |
| A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. |
| 7520317 |
Orientation insensitive compact thermosiphon with a remote auxiliary condenser |
April 21, 2009 |
| A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the |
| 7509995 |
Heat dissipation element for cooling electronic devices |
March 31, 2009 |
| A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic |
| 7506682 |
Liquid cooled thermosiphon for electronic components |
March 24, 2009 |
| A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of |
| 7497249 |
Thermosiphon for laptop computer |
March 3, 2009 |
| A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the cham |
| 7475718 |
Orientation insensitive multi chamber thermosiphon |
January 13, 2009 |
| A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to r |
| 7467657 |
Compact modular CPU cooling unit |
December 23, 2008 |
| A modular CPU cooling unit designed to fit within the available space within an existing box or cabinet containing a CPU. The fan, pump and liquid to air cross flow heat exchanger are fitted within the available volume with the fan spaced away from the heat exchanger a suitable dista |
| 7438124 |
Evaporative cooling system for a data-communications cabinet |
October 21, 2008 |
| An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for r |
| 7424906 |
High performance thermosiphon with internally enhanced condensation |
September 16, 2008 |
| A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device dur |
| 7422052 |
Low profile thermosiphon |
September 9, 2008 |
| A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile |
| 7406999 |
Capillary-assisted compact thermosiphon |
August 5, 2008 |
| A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the |
| 7331380 |
Radial flow micro-channel heat sink with impingement cooling |
February 19, 2008 |
| A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially |
| 7281390 |
Self-powered evaporative cooler |
October 16, 2007 |
| An indirect evaporative cooler assembly includes staggered wet and dry channels. An electric fan moves air through the assembly. Air passes through the wet channels where a material wicks moisture stored in a reservoir into the wet channels. As a result, the side walls of the wet cha |
| 7280363 |
Apparatus for controlling thermal interface between cold plate and integrated circuit chip |
October 9, 2007 |
| The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also inc |
| 7278471 |
Multi-layered micro-channel heat sink |
October 9, 2007 |
| The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the chann |
| 7213636 |
Cooling assembly with impingement cooled heat sink |
May 8, 2007 |
| The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto th |
| 7204299 |
Cooling assembly with sucessively contracting and expanding coolant flow |
April 17, 2007 |
| A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of p |
| 7143816 |
Heat sink for an electronic device |
December 5, 2006 |
| A heat sink for an electrical device is distinguished by a confining plate extending parallel to and along each lateral side of fins and extending upwardly from a top surface of a base to a bottom surface of a lid to define an outlet-chamber extending from the outer ends of the fins and |
| 7119434 |
Efficiency CPU cooling arrangement |
October 10, 2006 |
| A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, co |
| 7077189 |
Liquid cooled thermosiphon with flexible coolant tubes |
July 18, 2006 |
| A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-v |
| 7051761 |
Fill and bleed valve for liquid cooling system |
May 30, 2006 |
| A fill and bleed valve for filling a liquid cooling system has a single axially movable plunger, slidable within a central block bore, from a normal operating position to a filling position that opens the cooling system to a supply of coolant. The filling operation is continued until |
| 6989051 |
Portable air filtration system |
January 24, 2006 |
| A portable air filtration system includes a filter housing having an air inlet and an air outlet. The filter housing defines a filtration chamber between the air inlet and the air outlet. The portable air filtration system uses an ionizing mechanism, a filter media, and an electrode to |
| 6918431 |
Cooling assembly |
July 19, 2005 |
| A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and ar |
| 6840311 |
Compact thermosiphon for dissipating heat generated by electronic components |
January 11, 2005 |
| A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat |
| 6834713 |
Thermosiphon for electronics cooling with nonuniform airflow |
December 28, 2004 |
| A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defi |
| 6826948 |
Leak detection apparatus for a liquid circulation cooling system |
December 7, 2004 |
| A leak detection apparatus includes one or more detection devices that envelope the various pipe joints of a liquid circulation cooling system. In one approach, the detection devices include a pair of conductors separated by a wicking material impregnated with a crystalline salt that |
| 6714413 |
Compact thermosiphon with enhanced condenser for electronics cooling |
March 30, 2004 |
| A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defi |
| 6695039 |
Orientation insensitive thermosiphon assembly for cooling electronic components |
February 24, 2004 |
| A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A he |
| 6588498 |
Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
July 8, 2003 |
| A thermosiphon for cooling an electronic device having a mean width of dimension "b" comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electro |
