| Patent Number |
Title Of Patent |
Date Issued |
| 7553287 |
Guidewire having an embedded matrix polymer |
June 30, 2009 |
| A guidewire having an embedded matrix polymer construction and methods of making and using the same. The guidewire may include a core wire or member having a proximal region and distal region, a jacket disposed over the distal region, and a coil disposed over the jacket. The coil may |
| 7316656 |
Elongated intracorporal medical device |
January 8, 2008 |
| Alternative designs, materials and manufacturing methods for guidewires. Some embodiments pertain to a composite guidewire having proximal and distal section, and a connector adapted and configured for permanently joining the proximal section to the distal section. In some embodiments, |
| 7237313 |
Elongated medical device for intracorporal use |
July 3, 2007 |
| Alternative designs, materials and manufacturing methods for medical devices. Some embodiments disclosed deal with attachment of an elongated structure, such as a wire or ribbon, or a tubular member, such as a coil, to an elongated member in an elongated device. For example, an elongated |
| 7182735 |
Elongated intracorporal medical device |
February 27, 2007 |
| Alternative designs, materials and manufacturing methods for guidewires. Some embodiments pertain to a composite guidewire having proximal and distal section, and a connector adapted and configured for permanently joining the proximal section to the distal section. In some embodiments, |
| 7169118 |
Elongate medical device with distal cap |
January 30, 2007 |
| Elongate medical devices such as guidewires can be formed from a core wire and a preformed distal cap that is configured to fit over a distal end of the core wire. The distal cap can be attached using a variety of techniques. In particular, the distal cap can be attached to the core |
| 7153277 |
Composite medical device with markers |
December 26, 2006 |
| Medical devices and methods of manufacturing medical devices. The medical devices include an elongate member having a proximal portion and a distal portion and a connector assembly disposed adjacent the elongated member to connect the proximal and distal portions, the connector assembly |
| 7115101 |
Guide wire with hydrophilically coated tip |
October 3, 2006 |
| A guide wire including a lubricous distal portion and a less lubricous intermediate portion proximal of said distal portion. One guide wire provides a highly lubricous distal portion with a hydrophilic layer and a less lubricous intermediate portion with a hydrophobic layer. Another |
| 7077811 |
Guidewire tip construction |
July 18, 2006 |
| Guidewire with an improved distal end. A guidewire with an improved distal end may include a core wire, a solder tip disposed at a distal end of the core wire, a radiopaque inner coil coupled to the distal end of the core wire, an outer coil disposed along the length of the core wire, an |
| 6656134 |
Guide wire with hydrophilically coated tip |
December 2, 2003 |
| A guide wire including a lubricous distal portion and a less lubricous intermediate portion proximal of said distal portion. One guide wire provides a highly lubricous distal portion with a hydrophilic layer and a less lubricous intermediate portion with a hydrophobic layer. Another |
| 6251086 |
Guide wire with hydrophilically coated tip |
June 26, 2001 |
| A guide wire including a lubricous distal portion and a less lubricous intermediate portion proximal of said distal portion. One guide wire provides a highly lubricous distal portion with a hydrophilic layer and a less lubricous intermediate portion with a hydrophobic layer. Another |
| 5924998 |
Guide wire with hydrophilically coated tip |
July 20, 1999 |
| A guide wire including a lubricous distal portion and a less lubricous intermediate portion proximal of said distal portion. One guide wire provides a highly lubricous distal portion with a hydrophilic layer and a less lubricous intermediate portion with a hydrophobic layer. Another |
| 5308464 |
Low temperature tin-bismuth electroplating system |
May 3, 1994 |
| A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparat |
