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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Puri; Suraj
Address:
Los Altos, CA
No. of patents:
26
Patents:












Patent Number Title Of Patent Date Issued
8138482 Evaluating a cleaning solution using UV absorbance March 20, 2012
A process for evaluating a cleaning solution is described. The process includes: (i) subjecting a solution, including a solute and a solvent, to sonic energy to create a sonicated solution; (ii) measuring UV absorption of the sonicated solution to produce a sample UV absorbance spectra;
7914624 Systems and methods for charging a cleaning solution used for cleaning integrated circuit substr March 29, 2011
Inventive methods, systems and compositions of cleaning integrated circuit ("IC") substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged
7731800 Systems and methods for single integrated substrate cleaning and rinsing June 8, 2010
Inventive methods and systems of cleaning patterned integrated circuit ("IC") substrates are described. The cleaning methods of the present invention include: (1) providing the patterned integrated circuit substrate having thereon poly silicon lines adjacent to each other; (2) chargi
7655094 Systems and methods for charging a cleaning solution used for cleaning integrated circuit substr February 2, 2010
Inventive methods, systems and compositions of cleaning integrated circuit ("IC") substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged
6799583 Methods for cleaning microelectronic substrates using ultradilute cleaning liquids October 5, 2004
A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleani
6681781 Methods for cleaning microelectronic substrates using ultradilute cleaning liquids January 27, 2004
A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleani
6491043 Ultra-low particle semiconductor cleaner December 10, 2002
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and t
6352082 Ultra-low particle semiconductor cleaner March 5, 2002
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and t
6312597 Apparatus for delivering ultra-low particle counts in semiconductor manufacturing November 6, 2001
The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit,
6158446 Ultra-low particle semiconductor cleaner December 12, 2000
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face
6045621 Method for cleaning objects using a fluid charge April 4, 2000
A method for cleaning an object. The method (400) includes immersing (420) an object in a liquid comprising water, which can be ultra-clean. The object has a front face, a back face, and an edge. The method includes providing (450) a cleaning enhancement substance (e.g., trace amount of
6004399 Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from December 21, 1999
A method is described for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and
5988189 Method and apparatus for cleaning wafers using multiple tanks November 23, 1999
A cleaning system (1, 5) having multiple cleaning chambers (200) is provided. Each cleaning chamber (200) includes an interior region sufficient for immersing a carrier (242), which has at least one wafer disposed therein, into an ultra-clean liquid. The cleaning chamber (200) also h
5958146 Ultra-low particle semiconductor cleaner using heated fluids September 28, 1999
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a hot or heated liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the fr
5932027 Cleaning and drying photoresist coated wafers August 3, 1999
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as
5891256 Ultra-low particle semiconductor cleaner April 6, 1999
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid including water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face
5878760 Ultra-low particle semiconductor cleaner March 9, 1999
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and t
5873947 Ultra-low particle disk cleaner February 23, 1999
A technique for cleaning a hard disk using a novel support device 502. The technique includes immersing a disk in a liquid comprising water. The disk has a front face, a back face, an edge, and a center region. The method also includes providing a substantially particle free environment
5868150 Ultra-low particle semiconductor cleaner February 9, 1999
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and t
5849104 Method and apparatus for cleaning wafers using multiple tanks December 15, 1998
A cleaning system (1, 5) having multiple cleaning chambers (200) is provided. Each cleaning chamber (200) includes an interior region sufficient for immersing a carrier (242), which has at least one wafer disposed therein, into an ultra-clean liquid. The cleaning chamber (200) also h
5772784 Ultra-low particle semiconductor cleaner June 30, 1998
A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and t
5685327 Ultra-low particle semiconductor apparatus November 11, 1997
Apparatus for cleaning and drying a semiconductor wafer. The apparatus includes a vessel adapted to immerse a partially completed semiconductor wafer in a liquid comprising water. The apparatus also includes a control valve operably coupled to the vessel through a drain, and adapted to a
5651379 Method and apparatus for delivering ultra-low particle counts in semiconductor manufacturing July 29, 1997
The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit,
5634978 Ultra-low particle semiconductor method June 3, 1997
A method operates a system for wet processing of semiconductors. The system includes an inlet coupled to a fluid source, and a filter coupled to the inlet. The system also includes a sealed vessel coupled to the filter where the sealed vessel has a lower liquid portion and an upper vapor
5571337 Method for cleaning and drying a semiconductor wafer November 5, 1996
A method for drying articles with flat surfaces such as a semiconductor wafer. The method includes steps of immersing a semiconductor wafer in a liquid such as water, and displacing the liquid with a gaseous mixture. The liquid is displaced adjacent to a face of the wafer as measured fro
5542441 Apparatus for delivering ultra-low particle counts in semiconductor manufacturing August 6, 1996
The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit,










 
 
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