| Patent Number |
Title Of Patent |
Date Issued |
| 7601050 |
Polishing apparatus with grooved subpad |
October 13, 2009 |
| A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad havi |
| 7553214 |
Polishing article with integrated window stripe |
June 30, 2009 |
| A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material. |
| 7429210 |
Materials for chemical mechanical polishing |
September 30, 2008 |
| A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively |
| 7179159 |
Materials for chemical mechanical polishing |
February 20, 2007 |
| A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively |
| 7063597 |
Polishing processes for shallow trench isolation substrates |
June 20, 2006 |
| Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, suc |
| 7040966 |
Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor |
May 9, 2006 |
| A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to |
| 6220941 |
Method of post CMP defect stability improvement |
April 24, 2001 |
| The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface |
