| Patent Number |
Title Of Patent |
Date Issued |
| 7553063 |
Press-in place LED for a digital switching cross-connect module |
June 30, 2009 |
| A tracer lamp unit for use with a DSX system is disclosed herein. The tracer lamp unit includes an elongate housing with a generally rounded cross section wherein the housing is configured to be secured within an opening defined by a piece of telecommunications equipment and held wit |
| 7384305 |
High density mount for a co-axial connector |
June 10, 2008 |
| The present disclosure relates to a connector having a main body portion and a housing portion. The housing mounts over the connector main body. The housing is adapted for securing the connector to another element such as a piece of telecommunications equipment. |
| 7182502 |
Press-in place LED for a digital switching cross-connect module |
February 27, 2007 |
| A tracer lamp unit for use with a DSX system is disclosed herein. The tracer lamp unit includes an elongate housing with a generally rounded cross section wherein the housing is configured to be secured within an opening defined by a piece of telecommunications equipment and held wit |
| 7150656 |
Digital switching cross-connect module |
December 19, 2006 |
| A cross-connect module is disclosed herein. The cross-connect module includes a housing having a front end and a rear end. The rear end includes a printed circuit board mounted to the module. First and second switching jacks positioned adjacent the front end of the housing. A DIN typ |
| 7029323 |
High density mount for a co-axial connector |
April 18, 2006 |
| The present disclosure relates to a connector having a main body portion and a housing portion. The housing mounts over the connector main body. The housing is adapted for securing the connector to another element such as a piece of telecommunications equipment. |
| 6865085 |
Heat dissipation for electronic enclosures |
March 8, 2005 |
| An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card cages including an outer frame member in direct physical and thermal contact with an inner |
| 6781830 |
Methods and systems of heat transfer for electronic enclosures |
August 24, 2004 |
| An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink pro |
