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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Peters; Frank H.
Address:
San Jose, CA
No. of patents:
22
Patents:




Patent Number Title Of Patent Date Issued
7555220 Chromatic dispersion compensator (CDC) in a photonic integrated circuit (PIC) chip and method of June 30, 2009
An optical equalizer/dispersion compensator (E/CDC) comprises an input/output for receiving a multiplexed channel signal comprising a plurality of channel signals of different wavelengths. An optical amplifier may be coupled to receive, as an input/output, the multiplexed channel sig
7519246 Photonic integrated circuit (PIC) chips April 14, 2009
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to
7295589 Frequency modulated vertical cavity laser November 13, 2007
A frequency modulated (FM) vertical cavity surface emitting laser (VCSEL). The frequency modulated VCSEL includes a mirror region that has an active region. The frequency modulated VCSEL also includes a phase adjustment region for use in altering the characteristics of the VCSEL. For exa
7283694 Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs October 16, 2007
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to
7236656 Optical transport network June 26, 2007
An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.
7158699 Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic int January 2, 2007
A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The Rx
7135382 In-wafer testing of integrated optical components in photonic integrated circuits (PICs) November 14, 2006
Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
7129100 In-wafer testing of integrated optical components in photonic integrated circuits (PICs) October 31, 2006
Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
7123786 Compact, cost-effective optical-electrical-optical (OEO) converter for an optical transmission n October 17, 2006
An optical-to-electrical-to-optical converter comprises a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip comprising an optical waveguide formed in the chip from a chip input to receive a first multiplexed channel signal from an optical link and provide them to an
7116694 Transmitter array with pixel element that has primary semiconductor laser and at least one secon October 3, 2006
A transmitter array that has at least one pixel element. Each pixel element includes at least a primary semiconductor laser and a secondary semiconductor laser. In this manner, when the primary semiconductor laser is inoperative, the secondary semiconductor laser is utilized for tran
7092425 VCSEL device with improved modal properties August 15, 2006
Using lateral physical modulation, the optical properties of VCSELs can be stabilized and controlled by spatially varying the characteristics of the device material. This results in stabilization of the linewidth, the numerical aperture, the near and far field, as a function of bias and
7079718 Optical probe and method of testing employing an interrogation beam or optical pickup July 18, 2006
An optical probe and a method for testing an optical chip or device, such as an photonic integrated circuit (PIC), to provide for testing of such devices or circuits while they are still in their in-wafer form and is accomplished by using a an optical probe for interrogation of the circu
7058263 Optical transport network June 6, 2006
An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.
7050719 Wavelength division multiplexing receiver for wavelength tracking May 23, 2006
The WDM receiver includes a wavelength demultiplexer, a detector array and a signal extractor. The wavelength demultiplexer receives an n-channel optical input signal and transmits the n-channel optical input signal to m optical outputs. Each of the optical outputs receives a wavelength
7049570 Optical chip coupling system utilizing micromachine adjustable optical elements and a feedback c May 23, 2006
An optical communication system including an integrated circuit chip, an electro-optical chip operatively integrated on the integrated circuit chip, an adjustable optical chip which includes at least one optical element disposed between the electro-optical chip and one of a source or
7027703 Method for forming and apparatus comprising optical waveguides leading to a free space coupler r April 11, 2006
A method for forming and apparatus comprising a free space coupler region having a plurality of optical waveguides coupled to the space coupler region at an interface region, the waveguides converging with one another to the interface region, and a trench formed between adjacent waveguid
7006719 In-wafer testing of integrated optical components in photonic integrated circuits (PICs) February 28, 2006
Disclosed are apparatus and methods of reducing insertion loss, passivation, planarization and in-wafer testing of integrated optical components and in-wafer chips in photonic integrated circuits (PICs).
6999489 Electrical isolation of optical components in photonic integrated circuits (PICs) February 14, 2006
A method of electrically isolating and operating electro-optical components integrated in a monolithic semiconductor photonic chip, such as an EML or PIC chip. A bias, V.sub.C, is applied to the isolation region so that any parasitical current path developed between adjacent active o
6922422 Heat isolation and dissipation structures for optical components in photonic integrated circuits July 26, 2005
Photonic integrated circuits (PIC) semiconductor chips are provided with thermal isolation and/or heat dissipation structures between integrated optical components in the PIC chip, particularly integrated active optical components. These structures may also serve as a ground path for
6839370 Optoelectronic device using a disabled tunnel junction for current confinement January 4, 2005
An optoelectronic device such as a vertical cavity surface emitting laser (VCSEL) includes a tunnel junction that conducts a current of holes tunneling into an active region. Tunneling in a selected area of the tunnel junction is disabled to form a current blocking region that confin
6804271 Light emission methods and light emission devices October 12, 2004
Light emission methods and light emission devices are described including method and devices capable of emitting light at a plurality of controllable wavelengths. According to one aspect, a light emission method includes providing a control signal and emitting light using a laser ope
6771682 Electrical isolation of optical components in photonic integrated circuits (PICs) August 3, 2004
Electrical isolation regions are formed between adjacently disposed electro-optical components integrated in a monolithic semiconductor photonic chip, such as an EML or PIC chip. A bias, V.sub.C, is applied to the isolation region so that any parasitical current path developed betwee


 
 
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