Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Pecen; Jiri
Address:
Palo Alto, CA
No. of patents:
10
Patents:












Patent Number Title Of Patent Date Issued
6621584 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing September 16, 2003
An apparatus and method for in-situ monitoring of thickness during chemical-mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring
6261155 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical p July 17, 2001
A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film
6254459 Wafer polishing device with movable window July 3, 2001
A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing p
6146248 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical p November 14, 2000
A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film
6111634 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer d August 29, 2000
A method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window
6108091 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing August 22, 2000
An apparatus and method for in-situ monitoring of thickness during chemical-mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring
6068539 Wafer polishing device with movable window May 30, 2000
A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing p
5083035 Position location in surface scanning using interval timing between scan marks on test wafers January 21, 1992
A particle imager and method for imaging particles on surfaces of substrates. A surface is raster scanned by a collimated light beam and particles on the surface are detected by the scattered light caused by the particles. During a scan path the intensity of the scattered light is me
4766324 Particle detection method including comparison between sequential scans August 23, 1988
A particle detection method for matching particles detected in two scans of a surface taken at different times in which particles having a light scattering intensity above a collection threshold are first detected and the measured position and scattering intensity therefor stored in a
4641967 Particle position correlator and correlation method for a surface scanner February 10, 1987
A method and apparatus for particle detection and position correlation that fuses separate detections of the same particle on adjacent scan lines into one. A first scan line on a surface is scanned with a laser beam and the scattered light detected. The detection generates address and am










 
 
  Recently Added Patents
System and method for oscillator frequency control
Front end for RF transmitting-receiving systems with implicit directional control and time-multiplexing method in submicron technology
Correlating trace data streams
Method and system for providing geohazard information to customers
Methods and apparatus for power amplifier calibration
System and method for access of user accounts on remote servers
Communication device and method for detecting a radio signal
  Randomly Featured Patents
Fluidized bed firing system
Curable organopolysiloxane compositions
Method for producing .alpha.-hydroxycarboxylic acid
Vehicle wheel
Method for making a lead-on-chip semiconductor device having peripheral bond pads
Multilayer electrode for ferroelectric and high dielectric constant capacitors
Detection system for Raman scattering employing holographic diffraction
Power tool holder
High purity (1R,2S,4R)-(-)-2-[(2'-{N,N-dimethylamino}-ethoxy)]-2-[phenyl]-1,7,7-tri-[m ethyl]-bicyclo[2.2.1]heptane and pharmaceutically acceptable acid addition salts thereof
Lily plant named Marco Polo