| Patent Number |
Title Of Patent |
Date Issued |
| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
March 11, 2003 |
| A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. L |
| 5965078 |
Method for manufacturing prepackaged molding compound for component encapsulation |
October 12, 1999 |
| A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by run |
| 5949132 |
Dambarless leadframe for molded component encapsulation |
September 7, 1999 |
| A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less t |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
June 15, 1999 |
| A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. L |
| 5891377 |
Dambarless leadframe for molded component encapsulation |
April 6, 1999 |
| A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less t |
| 5888443 |
Method for manufacturing prepackaged molding compound for component encapsulation |
March 30, 1999 |
| A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by run |
| 5885506 |
Pre-packaged molding for component encapsulation |
March 23, 1999 |
| A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip |
| 5431854 |
Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressi |
July 11, 1995 |
| Method for pressing a plastic (6), which cures by means of a reaction, from a displacement chamber (4) via at least one injection channel (3) and a gate (2) to a mould cavity (1), said method at least comprising the following steps: pressurising the plastic (6) with an amount of a pressi |
| 4890725 |
Automatic continuously cycleable molding system and method |
January 2, 1990 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4877387 |
Automatic continuously cycleable molding system |
October 31, 1989 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4712994 |
Apparatus for cold runner transfer molding |
December 15, 1987 |
| A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-cont |
| 4710094 |
Automatic continuously cycleable molding system and method |
December 1, 1987 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4669599 |
Apparatus and method for handling a workpiece |
June 2, 1987 |
| An apparatus and method for handling a workpiece includes the combination of a first workpiece position for checking the presence of a workpiece and a second subsequent position for checking the orientation of a workpiece. An orientation device adjacent the orientation checking position |
| 4575328 |
Automatic continuously cycleable molding apparatus |
March 11, 1986 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4553420 |
Method and apparatus for touch-free lead bending |
November 19, 1985 |
| Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and |
| 4534921 |
Method and apparatus for mold cleaning by reverse sputtering |
August 13, 1985 |
| A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor c |
