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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Park; Tae-Sang
Address:
Suwon-si, KR
No. of patents:
11
Patents:












Patent Number Title Of Patent Date Issued
8120840 Electrorheological fluid having properties of newtonian fluid February 21, 2012
An electrorheological fluid is provided. The electrorheological fluid includes polarizing particles and a dispersion medium in which the polarizing particles are dispersed. The polarizing particles may include silica particles. The dispersion medium may include silicon oil. The silic
7850748 Burner for fuel reformer of fuel cell system December 14, 2010
A fuel reformer burner for a polymer electrolyte membrane fuel cell (PEMFC) system includes a first tube through which a fuel for a fuel reformer is supplied and a second tube through which anode-off gas (AOG) is supplied from a fuel cell stack. The second tube is not connected to th
7758984 Shift reactor, fuel cell system employing the same, and operating method of the same July 20, 2010
A shift reactor for fuel cells, a fuel cell system employing the same, and an operating method of the same are provided. More particularly, a shift reactor for fuel cells is filled with a shift catalyst and includes an inlet through which reactants flow into the shift reactor and an outl
7740811 Hydrogen generator having double burners and method of operating the same June 22, 2010
A hydrogen generator having double burners and a method of operating the samewhere the hydrogen generator includes a housing, a barrier wall to divide a space in the housing into a first chamber and a second chamber, a fuel reformer installed in the first chamber, a first burner installe
7705343 Phase change random access memory devices and methods of operating the same April 27, 2010
Provided are phase change random access memory (PRAM) devices and methods of operating the same. The PRAM device may include a switching device, a lower electrode, a lower electrode contact layer, a phase change layer and/or an upper electrode. The lower electrode may be connected to a
7619837 Varifocal optical device November 17, 2009
A varifocal optical device is provided. The varifocal optical device includes an optical lens, an actuator unit connected with the optical lens and having two areas that are bending-deformed in opposite directions to each other when a voltage is applied thereto, and a supporting unit
7582163 Apparatus for processing surface of substrate September 1, 2009
A substrate surface processing apparatus is provided. In the substrate surface processing apparatus, a spin chuck holds a substrate thereon by suction, spins the substrate, and moves up and down the substrate. An upper bowl and a lower bowl surround the spin chuck for receiving a pro
7448604 Heat treatment apparatus November 11, 2008
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate
7377776 Semiconductor wafer baking apparatus May 27, 2008
A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one
7372125 Phase change memory devices using magnetic resistance effect, methods of operating and methods o May 13, 2008
A phase change memory device includes a substrate, a switching element formed in the substrate and a storage node connected to the switching element. The storage node may include a lower electrode connected to the switching element, a first phase change layer formed on the lower elec
7115840 Wafer bake apparatus October 3, 2006
A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the










 
 
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