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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Pan; Alfred I-Tsung
Address:
Sunnyvale, CA
No. of patents:
33
Patents:




Patent Number Title Of Patent Date Issued
7597991 Flex based fuel cell October 6, 2009
A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchang
7554566 Image development methods, hard imaging devices, and image members June 30, 2009
Image development methods, hard imaging devices, and image members are described. According to one embodiment, an image development method includes providing an image member comprising a surface having different portions of different electrical conductivities, wherein one of the port
7435497 Metal coated polymer electrolyte membrane having a reinforcement structure October 14, 2008
A metal-coated, wire-reinforced polymer electrolyte membrane that is permeable only to protons and hydrogen is disclosed. The metal-coated, wire-reinforced polymer electrolyte membrane has a surface microsturcture that prevents cracking of the metal coating during hydration. The meta
7371481 Electrode having macropores and micropores therein May 13, 2008
An electrode is disclosed. The electrode includes a substrate having macropores therein. A barrier support layer, established on the substrate, has micropores therein. The macropores and at least some of the micropores are substantially lined with an electrolyte layer. A catalyst is
7361426 Surface structure for enhancing catalyst reactivity and method of manufacturing thereof April 22, 2008
A method of enhancing catalyst reactivity includes (1) depositing a conductive oxide on a suitable substrate, (2) depositing a thin film of catalyst on top of the conductive oxide to form a sandwich structure, and (3) annealing the structure at a, suitable temperature so that the thin
7341680 Printable composition with nanostructures of first and second types March 11, 2008
A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable
7255950 Fuel delivery system and method of use thereof August 14, 2007
A fuel delivery system for a liquid-type fuel cell and method of use are disclosed. The fuel delivery system includes a fuel tank and a fuel controller. The fuel tank stores a concentrated fuel, which is delivered to a chamber containing a diluted fuel. The fuel delivery is controlled
7163844 Monolithic common carrier January 16, 2007
A common carrier for forming multiple printheads thereon and method of forming thereof is described. The common carrier includes a carrier substrate for adhering a plurality of unprocessed, integrateable semiconductor chips. Once adhered, the carrier substrate is lithographically pro
7129844 Remote communications devices, wireless communications systems, remote communications device ope October 31, 2006
Remote communications devices, wireless communications systems, remote communications device operable methods, and retail article monitoring methods are described. According to one embodiment, a remote communications device includes communications circuitry configured to implement wi
7062848 Printable compositions having anisometric nanostructures for use in printed electronics June 20, 2006
Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostru
6982734 Printing on electrically writable media and electrically writable displays January 3, 2006
Apparatus and methods of printing on electrically writable media and electrically writable displays are described. In one aspect, a printer for printing on an electrically writable medium includes a source of an invisible charge species, and a charge species projector. The charge spe
6977009 Metal coated polymer electrolyte membrane having a reinforcement structure December 20, 2005
A metal-coated, wire-reinforced polymer electrolyte membrane that is permeable only to protons and hydrogen is disclosed. The metal-coated, wire-reinforced polymer electrolyte membrane has a surface microstructure that prevents cracking of the metal coating during hydration. The meta
6921593 Fuel additives for fuel cell July 26, 2005
A method of enhancing performance of liquid-type fuel cells by adding additives to the liquid fuel. For example, hemoglobin, surfactants, oxygen scavengers, and chelating agents, may be added to the fuel to resolve problems such as CO poisoning of catalyst, wettability of electrodes, and
6833212 Electrolyte for a fuel cell December 21, 2004
An electrolyte for a fuel cell includes an electrolyte body, a plurality of microstructures formed into or extending out of the electrolyte body, and thin film layers formed on the electrolyte body. A microstructure possesses a depth or a height and includes one or more sidewalls and a
6812564 Monolithic common carrier November 2, 2004
A common carrier for forming multiple printheads thereon and method of forming thereof is described. The common carrier includes a carrier substrate for adhering a plurality of unprocessed, integrateable semiconductor chips. Once adhered, the carrier substrate is lithographically pro
6800323 Porously coated open-structure substrate and method of manufacture thereof October 5, 2004
A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on
6715859 Thermal ink jet resistor passivation April 6, 2004
A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with .ltoreq.10 wt. % Co, .ltoreq.20 wt. % Cr, .ltoreq.10 wt. % Mn. The passivation layer is amorphous and the surface is
6707479 Apparatus and methods of printing on an electrically writable medium March 16, 2004
Apparatus and methods of printing on an electrically writable medium are disclosed. In one aspect, a printer for printing on an electrically writable medium includes a print head and a biasing system. The print head has multiple solenoid-actuated print wires that are operable to reci
6659592 Multiple redundant through hole electrical interconnects and method for forming the same December 9, 2003
An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A
6656526 Porously coated open-structure substrate and method of manufacture thereof December 2, 2003
A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on
6620542 Flex based fuel cell September 16, 2003
A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchang
6588095 Method of processing a device by electrophoresis coating July 8, 2003
A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet head device and a flexible tape circuit connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection
6536875 Actuator apparatus, process of forming thereof and method of actuation March 25, 2003
An actuator apparatus, process of forming thereof, and method of actuation are described in which a flexible member having opposing surface electrodes positioned between two substrates having opposing surface electrodes is caused to move by charging and discharging the opposing flexi
6533391 Self-aligned modules for a page wide printhead March 18, 2003
A system for precision self-alignment of multiple modules on an alignment substrate is disclosed. An alignment substrate includes a plurality of self-alignment features having a first profile formed in along a mounting surface thereof. A plurality of module substrates are mounted on the
6501663 Three-dimensional interconnect system December 31, 2002
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system includes a plurality of contiguously interconnected electrically conductive droplets such as
6460966 Thin film microheaters for assembly of inkjet printhead assemblies October 8, 2002
A method and apparatus for assembling an inkjet printhead is disclosed. The apparatus comprises one or more microheater resistors and a material, which can be reflowed by use of the heat generated by the microheater, disposed proximate to the heater resistor. The microheater resistor
6457811 Self-aligned interconnect and method for producing same October 1, 2002
A self-aligned interconnect significantly reduces manufacturing costs and provides important advantages in a number of specific applications begins with a single crystal substrate. The substrate is machined to accept microelectronic chips at various locations (openings) along the substra
6443557 Chip-carrier for improved drop directionality September 3, 2002
A carrier frame having an aperture and a nozzle plate disposed on the carrier frame and positioned over the aperture is described. The nozzle plate has at least one nozzle formed between opposing surfaces of the nozzle plate. The carrier frame and the nozzle plate are made from mater
6366468 Self-aligned common carrier April 2, 2002
Precision alignment of one or more parts on a common carrier is described. A self-aligned common carrier includes a carrier substrate having one or more pockets formed in the substrate. Each pocket includes a side profile formed in the pocket. A chip having an identical side profile that
6142611 Oxide island structure for flexible inkjet printhead and method of manufacture thereof November 7, 2000
A component for a printhead of an inkjet printer includes a flexible substrate and oxide island heat barriers. The oxide islands allow the flexible substrate to be bent without cracking the oxide islands, a problem which otherwise occurs when the heat barrier is a continuous oxide la
5993917 Method and apparatus for improving wettability of foam November 30, 1999
The present invention is a method of treating foam for improving wettability. The method includes treating foam with reactive species which interact to produce reaction products. The reaction products are then removed from foam. Finally, after removing reaction products the foam is t
5872582 Microfluid valve for modulating fluid flow within an ink-jet printer February 16, 1999
A valve device is incorporated within a printhead of an ink-jet pen for regulation of ink flow and pressure within the printhead. The valve device includes a valve member comprising a resiliently deformable flap positioned in an ink channel, adjacent a firing chamber. The flap is def
5008689 Plastic substrate for thermal ink jet printer April 16, 1991
A substrate for the print head of an ink jet printer includes a plastic base, a metallization layer overlying the plastic base, and a dielectric structure overlying the metallization layer. A thin film resistor is deposited over the substrate, as required. Preferred materials include


 
 
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