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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Oosaka; Shingo
Address:
Hakodate, JP
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
7816185 Method of manufacturing a semiconductor device October 19, 2010
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7579216 Method of manufacturing a semiconductor device August 25, 2009
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7384820 Method of manufacturing a semiconductor device June 10, 2008
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7033857 Method of manufacturing a semiconductor device April 25, 2006
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t










 
 
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