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Inventor: Oonami; Takahisa
Address: Machida, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7553768 |
Substrate and a method for polishing a substrate |
June 30, 2009 |
| A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base laye |
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