A process for cleaning the silicon surface of a semiconductor device material layer. The surface undergoes a pre-clean process followed by exposure to a nitrogen-containing gas. A polysilicon layer is formed on the surface in the same chamber and at about the same temperature as the
The present invention provides a method of determining an endpoint of a reduction reaction of a metal deposited on a semiconductor wafer. The method comprises reducing an oxidized portion of the metal by subjecting the oxidized portion to a reducing agent that forms a reduction by-produc
The present invention relates to an apparatus and method for depositing a film on a wafer. A reactor for depositing a film on a surface of a wafer comprises a processing chamber having an electrode, a ceramic wafer support supporting the wafer and separated from the electrode by a di
A method of forming a passivation layer over features located on a top layer on a semiconductor device comprises depositing a first void-free layer of a dielectric over the top layer using high density plasma chemical vapor deposition. A second void-free layer can additionally be dep
A method for forming a dielectric layer in an integrated circuit is disclosed. After a first dielectric layer is formed, a second dielectric layer is formed on top of the first layer. The second layer is formed by reducing precursor gas flow during the initial portion of the deposition
In plasma enhanced chemical vapor deposition (PECVD) of silicon dioxide on a substrate, voids and discontinuities are reduced by first depositing silicon dioxide in a sputter each chamber (22) in which a magnetic field is produced within the rf plasma for depositing the silicon dioxide.
