Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Okumura; Naohisa
Address:
Yokohama, JP
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
8288855 Semiconductor memory device and semiconductor memory card October 16, 2012
A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips w
8274141 Semiconductor memory card and semiconductor memory device September 25, 2012
A semiconductor memory card includes a wiring board having an outer shape where a cut-out portion is provided at a first long-edge. A second surface of the wiring board includes connection pads disposed along a portion except the cut-out portion of the first long-edge. A memory devic
8080868 Semiconductor memory device and semiconductor memory card December 20, 2011
A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips w
8064206 Semiconductor memory device and semiconductor memory card using the same November 22, 2011
A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a t
7911045 Semiconductor element and semiconductor device March 22, 2011
A semiconductor element is provided with electrode pads which are arranged on a front surface of an element main body, an insulating protection film which covers the front surface of the element main body excepting its outer peripheral area while exposing the electrode pads, and an i
7898813 Semiconductor memory device and semiconductor memory card using the same March 1, 2011
A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a t
7880312 Semiconductor memory device February 1, 2011
A plurality of semiconductor memory chips are stacked on a first main surface of a wiring board, and an interposer chip is stacked on the plurality of semiconductor chips, and a semiconductor controller chip is stacked on the interposer chip. The plurality of semiconductor memory chi
7855446 Semiconductor memory device and semiconductor memory card December 21, 2010
A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips w
7732930 Semiconductor device, relay chip, and method for producing relay chip June 8, 2010
A semiconductor device including a circuit substrate including n number of terminals; a semiconductor chip provided on the circuit substrate and including n number of terminals; and a relay chip including a triangular substrate having a first side, a second side and a third side which fo
7649734 Portable storage device January 19, 2010
A portable storage device which is used by being connected to terminals of an external apparatus, comprises a main body of a rectangular cover case, in which an opening is formed at a front and a fit opening is formed in a wall; a rectangular terminal enclosure supported inside said main
7608787 Semiconductor memory device and USB memory device using the same October 27, 2009
A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the
5714799 Resin-sealed type semiconductor device having an unoccupied second die pad February 3, 1998
A resin-sealed type semiconductor device is provided which has a lead array with a plurality of leads arranged at a predetermined interval. A first die pad is provided substantially flush with the lead array. A semiconductor chip is mounted on the first pad and electrically connected










 
 
  Recently Added Patents
Bitter taste receptors
Combination of the application of antibodies for immunostimulation together with glucocorticoids
Messenger bag
Method for producing purified influenza virus antigen
Wind energy system having a connection protection device
Apparatus and method of preventing signal delay in display device
Enhanced claims damage estimation using aggregate display
  Randomly Featured Patents
Data encoding apparatus and data decoding apparatus
Spraying equipment
Removable electronic device with handle structure
Carafe
Method for producing group III nitride semiconductor layer, group III nitride semiconductor light-emitting device, and lamp
Telescopic rail system and a refrigerator and/or freezer unit
MOS type semiconductor device
Height adjusting device for car seat
Optical modulation device
Polyester/polycarbonate alloy resin composition and molded product made using the same