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Ogoshi; Nobumori
Tokyo, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7544587 Wafer dividing method and wafer dividing apparatus June 9, 2009
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step fo

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