Resources Contact Us Home
Ogoshi; Nobumori
Tokyo, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7544587 Wafer dividing method and wafer dividing apparatus June 9, 2009
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step fo

  Recently Added Patents
Spectral sensor for checking documents of value
Data consumption framework for semantic objects
Method for producing a flexible composite elastomeric polyurethane skin
Conductor-mixed active electrode material, electrode structure, rechargeable battery, and manufacturing method of conductor-mixed active electrode material
Sending targeted product offerings based on personal information
Peptides useful in the treatment and/or care of skin, mucous membranes, scalp and/or hair and their use in cosmetic or pharmaceutical compositions
  Randomly Featured Patents
Rectangular computer table
Preparation of para-acyloxybenzene sulfonates
Seat backrest having an adjustable lumbar support
Convergence measuring apparatus
Electrophoresis method and apparatus for separating bio-organic molecules
Air/fuel ratio sensor having oxygen sensor cell and oxygen pump cell
Apparatus facilitating connection of trailer implement to tractor three-point hitch system
Video MP3 system with apparatus and method for generating and restoring reduced video data
Method and system for privacy in public networks
Connector having locking lance with lance beak part and locking projection