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Inventor: Ogoshi; Nobumori
Address: Tokyo, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7544587 |
Wafer dividing method and wafer dividing apparatus |
June 9, 2009 |
| A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step fo |
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