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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Nishimura; Takao
Address:
Kawasaki, JP
No. of patents:
23
Patents:












Patent Number Title Of Patent Date Issued
8230590 Method for mounting electronic components July 31, 2012
A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive.
8216934 Semiconductor device suitable for a stacked structure July 10, 2012
A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed
8198728 Semiconductor device and plural semiconductor elements with suppressed bending June 12, 2012
A semiconductor device includes a supporting base whereupon an electrode terminal is placed; an intermediate member mounted on said supporting base; a semiconductor element, a portion thereof being supported with said intermediate member, and placed on said supporting base; and a con
8134240 Semiconductor device and manufacturing method for the same March 13, 2012
To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10
8125789 Wiring substrate and electronic device February 28, 2012
A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion
8076785 Semiconductor device December 13, 2011
A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provide
8076769 Semiconductor device and manufacturing method of semiconductor device December 13, 2011
A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elas
8048719 Semiconductor device and manufacturing method thereof November 1, 2011
A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of
7973404 Relay board provided in semiconductor device, semiconductor device, and manufacturing method of July 5, 2011
A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main sur
7906852 Semiconductor device and manufacturing method of the same March 15, 2011
A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first
7884459 Semiconductor device suitable for a stacked structure February 8, 2011
A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed
7880276 Wiring board and semiconductor device February 1, 2011
A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic co
7755203 Circuit substrate and semiconductor device July 13, 2010
A circuit substrate for improving the reliability and productivity of a semiconductor device, and that semiconductor device. In a circuit substrate to which a semiconductor element is to be flip-chip mounted, at least one island-shaped electrically conductive layer is selectively dis
7687319 Semiconductor device and manufacturing method thereof March 30, 2010
The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at l
7679188 Semiconductor device having a bump formed over an electrode pad March 16, 2010
To provide a high-performance, highly-reliable semiconductor device in which an adhesive used to mount (e.g., flip-chip mount) a semiconductor chip on a substrate has less air bubbles, and a low-cost, efficient method for manufacturing the same. Semiconductor device 10 of the present
7528460 Semiconductor device sealed with electrical insulation sealing member May 5, 2009
A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of
7217993 Stacked-type semiconductor device May 15, 2007
A stacked-type semiconductor device includes a first wiring substrate on which a semiconductor device element is mounted, a second wiring substrate stacked on the first wiring substrate through a plurality of electrode terminals which are electrically connected with the first wiring
7049692 Stacked semiconductor device May 23, 2006
A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer substrate being provided between an upper device unit and a lower device unit. The upper device
6960827 Semiconductor device and manufacturing method thereof November 1, 2005
A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are
6781241 Semiconductor device and manufacturing method thereof August 24, 2004
A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are
6777799 Stacked semiconductor device and method of producing the same August 17, 2004
In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on t
6621169 Stacked semiconductor device and method of producing the same September 16, 2003
In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on t
6239486 Semiconductor device having cap May 29, 2001
The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls 14 extending downward from the top wall and a bottom wall. Opening are provided in the










 
 
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