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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Nishimura; Shin
Address:
Hitachi, JP
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
7923580 Polymerizable boric compounds, methods of producing the same, polymerizable compositions and ion April 12, 2011
A polymerizable boric compound for electrochemical devices represented by the formula (1), wherein, B represents a boron atom, Z represents a polymerizable functional group, X represents a divalent C.sub.1-12 hydrocarbon group or in the absence of X, Z and B form a direct bond, AO re
7759003 Polymerizable boric compounds, methods of producing the same, polymerizable compositions and ion July 20, 2010
A polymerizable boric compound for electrochemical devices represented by the formula (1), wherein, B represents a boron atom, Z represents a polymerizable functional group, X represents a divalent C.sub.1-12 hydrocarbon group or in the absence of X, Z and B form a direct bond, AO re
7704642 Cationic conductor, its intermediate, and lithium secondary battery using the conductor April 27, 2010
The disclosure discloses a polymer represented by the general formula, ##STR00001## wherein R.sub.p is a residue of a polymer of a compound having a polymerizable unsaturated bond, Q is an organic residue of n+1 valences and connected directly or through another group to R.sub.p by
7473492 Lithium secondary battery January 6, 2009
The object of the present invention is to provide a lithium secondary battery of high output. According to the present invention, there is provided a lithium secondary battery having a positive electrode and a negative electrode which reversibly intercalate and deintercalate lithium
7300991 Cationic conductor, its intermediate, and lithium secondary battery using the conductor November 27, 2007
The disclosure discloses a polymer represented by the general formula, ##STR00001## wherein R.sub.p is a residue of a polymer of a compound having a polymerizable unsaturated bond, Q is an organic residue of n+1 valences and connected directly or through another group to R.sub.p by
7273677 Cationic conductor September 25, 2007
The present invention provides a cationic conductor comprising a block copolymer comprising: a polymer moiety having a structural unit represented by formula (1): ##STR00001## wherein R represents an organic group obtained via polymerization of monomer compounds having polymerizable
7230057 Boron-containing compound, ion-conductive polymer and polyelectrolyte for electrochemical device June 12, 2007
An object of the present invention is to provide a boron-containing compound capable of forming an ion-conductive polyelectrolyte having high ion-conductive properties, and a polymer of said compound. According to the present invention, there are provided a polymerizable boron-contai
7125629 Cationic conductor October 24, 2006
The present invention provides a cationic conductor comprising a block copolymer comprising: a polymer moiety having a structural unit represented by formula (1): ##STR00001## wherein R represents an organic group obtained via polymerization of monomer compounds having polymerizable
6462148 Adhesive film of quinoline polymer and bismaleimide October 8, 2002
A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6'-bis(2-(4-fluorophenyl)-4-phenylquinoline) and
5352762 Multilayer printed circuit board and production thereof October 4, 1994
A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by formin
5308888 Fluorine-containing curable resin composition and use thereof May 3, 1994
According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer
5098971 Fluorine-containing thermosetting resin March 24, 1992
A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability










 
 
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