Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Nishimura; Hiroyuki Address: Kyoto, JP No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 5302101 Mold for resin-packaging electronic components April 12, 1994 A mold for resin-packaging electronic components on a pair of leadframes includes an upper mold member and a lower mold member. The mold has two parallel rows of molding cavities, and a row of resin supplying portions arranged between the respective cavity rows. The respective molding       Recently Added Patents Pneumatic tire Optical device characterization Seat frames having appearance of one-piece construction and seat frames having a back support design derived from the frame Image pickup apparatus having compact, light weight, rigid internal chassis Increased ballistic performance of fabrics coated with polymer stripes High-density, robust connector for stacking applications Dual-edge shaping latch/synchronizer for re-aligning edges   Randomly Featured Patents Crankcase drainage device Voltage selective circuit of power source Index tab and method of making same Apparatus and process for countergravity casting of metal with air exclusion Protein coated hair protection apparatus and method Single port cardiac support apparatus Method and substance for the enhanced labelling of cellular material Electric miter saw Outrigger fishing clip Method and apparatus for purifying flue gases © 2006. PatentGenius. All Rights Reserved.