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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Ni; Cheng-Tsung
Address:
Hsinchu, TW
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
6888197 Power metal oxide semiconductor field effect transistor layout May 3, 2005
A power MOSFET layout according to one embodiment of the invention comprises a substrate and a plurality of cells. Each of the cells includes a base portion, a plurality of protruding portions extending from the base portion, and a plurality of photo-resist regions. Each of the cells is
6821913 Method for forming dual oxide layers at bottom of trench November 23, 2004
Embodiments of the present invention are directed to an improved method for forming dual oxide layers at the bottom of a trench of a substrate. A substrate has a trench which includes a bottom and a sidewall. The trench may be created by forming a mask oxide layer on the substrate; defin
6784115 Method of simultaneously implementing differential gate oxide thickness using fluorine bearing i August 31, 2004
Improved methods for fabricating semiconductor integrated circuit devices, in particular flash EEPROM devices. According to an embodiment, the present invention provides a method of forming a semiconductor device having a gate oxide layer (160) that is thin in some regions, such as the
6660592 Fabricating a DMOS transistor December 9, 2003
Embodiment of the present invention are directed to improving the performance of a DMOS transistor. A method of fabricating a DMOS transistor comprises providing a semiconductor substrate having a gate oxide and a trenched gate, and implanting first conductive dopants into a surface
6657263 MOS transistors having dual gates and self-aligned interconnect contact windows December 2, 2003
A method of fabricating an IC device on a substrate comprising MOS transistors and other IC components. Each of the transistors of the IC device comprises a raised source electrode, a raised drain electrode, dual gate electrodes and self-aligned interconnect contact windows, and is c
6284578 MOS transistors having dual gates and self-aligned interconnect contact windows September 4, 2001
A method of fabricating an IC device on a substrate comprising MOS transistors and other IC components. Each of the transistors of the IC device comprises a raised source electrode, a raised drain electrode, dual gate electrodes and self-aligned interconnect contact windows, and is c
6228729 MOS transistors having raised source and drain and interconnects May 8, 2001
A process for fabricating a semiconductor device comprising a gate electrode, a raised source, a raised drain and an interconnect inlaid into an isolation region. A semiconductor device is fabricated by a process comprising the following steps: forming sequentially a first dielectric
6150244 Method for fabricating MOS transistor having raised source and drain November 21, 2000
A process for fabricating a semiconductor device comprising a raised source and drain. A semiconductor device is fabricated by a process comprising the following steps: forming active regions separated by isolation regions; forming at each active region a gate electrode structure; de
6127699 Method for fabricating MOSFET having increased effective gate length October 3, 2000
A process for fabricating a semiconductor device comprising a source, a drain, and a gate electrode having an increased effective gate length. A semiconductor device is fabricated by a process comprising the following steps: forming active areas separated by field oxide regions; forming
6008106 Micro-trench oxidation by using rough oxide mask for field isolation December 28, 1999
A method of forming isolation region of an integrated circuit by using rough oxide mask is described. First, a layer of first dielectric is formed on the surface of a silicon substrate. The first dielectric layer is then patterned to define active device region and isolation region.
5972754 Method for fabricating MOSFET having increased effective gate length October 26, 1999
A process for fabricating a semiconductor device comprising a source, a drain, and a gate electrode having an increased effective gate length. A semiconductor device is fabricated by a process comprising the following steps: forming active areas separated by field oxide regions; forming
5804493 Method for preventing substrate damage during semiconductor fabrication September 8, 1998
A method for preventing substrate damage during semiconductor fabrication, comprising, forming a pad oxide layer on the substrate, depositing a polysilicon buffer layer on the pad oxide layer, ion-implanting fluorine into the polysilicon buffer layer, depositing a silicon nitride layer o










 
 
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