| Patent Number |
Title Of Patent |
Date Issued |
| 7259465 |
Semiconductor device with lead-free solder |
August 21, 2007 |
| Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds. |
| 7145236 |
Semiconductor device having solder bumps reliably reflow solderable |
December 5, 2006 |
| A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, a |
| 7048173 |
Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly |
May 23, 2006 |
| The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is |
| 7013564 |
Method of producing an electronic device having a PB free solder connection |
March 21, 2006 |
| A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn--Ag--Bi alloy solder is applied to an electrode through an Sn--Bi alloy layer. The Sn--Bi |
| 6960396 |
Pb-free solder-connected structure and electronic device |
November 1, 2005 |
| Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good |
| 6872465 |
Solder |
March 29, 2005 |
| In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are |
| 6774490 |
Electronic device |
August 10, 2004 |
| An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may a |
| 6585149 |
Packaging method using lead-free solder |
July 1, 2003 |
| A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the |
| 6563225 |
Product using Zn-Al alloy solder |
May 13, 2003 |
| There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al--Mg--Ge--Zn alloy, said Al |
| 6555052 |
Electron device and semiconductor device |
April 29, 2003 |
| An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may a |
| 6486411 |
Semiconductor module having solder bumps and solder portions with different materials and compos |
November 26, 2002 |
| A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a |
| 6204490 |
Method and apparatus of manufacturing an electronic circuit board |
March 20, 2001 |
| Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to |
| 5942185 |
Lead-free solder used for connecting electronic parts on organic substrate and electronic produc |
August 24, 1999 |
| Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provid |
