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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Nakao; Keiichi
Address:
Osaka, JP
No. of patents:
9
Patents:












Patent Number Title Of Patent Date Issued
8247474 Method of manufacturing base layer, ink for inkjet and electronic components August 21, 2012
A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents o
8178188 Base layer for manufacturing an electronic component by an etching process May 15, 2012
A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents o
8130499 Heat dissipating structure base board, module using heat dissipating structure base board, and m March 6, 2012
The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin st
7882747 Strain sensor and method for manufacture thereof February 8, 2011
The invention presents a strain sensor includes a substrate, a crystallized glass laminated on the substrate, a strain sensitive resistor laminated on the crystallized glass, in which the crystallized glass is formed by baking a plurality of types of crystallized glass powder having
7397340 Load sensor and its manufacturing method July 8, 2008
A load sensor includes a substrate, a glass layer provided on the substrate, a wiring provided on the glass layer, an adjusting layer provided on the glass layer, and a strain-sensitive resistor element provided on the adjusting layer and connected to the wiring. A thermal expansion
7164342 Load sensor and method of manufacturing the load sensor, paste used for the method, and method o January 16, 2007
The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, m
7097287 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device a August 29, 2006
Here disclosed is an ink jet apparatus having an ink-circulating/dispersing function. The apparatus provides ink with dispersion as required, and circulates the ink through a tube to an ink-collecting tank. During this circulation, a required amount of the ink is fed to a printer hea
6314637 Method of producing a chip resistor November 13, 2001
The invention relates to a chip resistor which is used as a circuit part for various electric apparatuses. The object of the invention is to realize a low resistance and a low TCR, and also high accuracy and high reliability. In order to achieve the object, a chip resistor is configured
5907274 Chip resistor May 25, 1999
The invention relates to a chip resistor which is used as a circuit part for various electric apparatuses. The object of the invention is to realize a low resistance and a low TCR, and also high accuracy and high reliability. In order to achieve the object, a chip resistor is configured










 
 
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