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Inventor:
Nakamura; Hiroshi
Address:
Tsuchiura, JP
No. of patents:
8
Patents:




Patent Number Title Of Patent Date Issued
6579954 Aromatic polysulfone resin composition and molded article containing the same June 17, 2003
A thermoplastic resin composition comprising an aromatic polysulfone resin and at least one resin selected from aromatic polyester resins, wherein the amount of alkali metal which exists in the aromatic polysulfone resin as a terminal phenolate is 50 ppm or less, and molded article there
6468665 Process for melt-bonding molded article of liquid crystalline polyester with metal October 22, 2002
Disclosed herein is a process for melt-bonding a molded article of a thermotropic liquid crystalline polyester with a metal, which comprises activating or irradiating a surface of a molded article of a thermotropic liquid crystalline polyester resin and melt-bonding the surface with a
6432323 Liquid crystal polyester resin composition and molded article August 13, 2002
Provided is a liquid crystal polyester resin composition comprising a liquid crystal polyester resin and surface-treated carbon fiber with an urethane resin, wherein the amount of an urethane resin on the carbon fiber is from 0.5 to 5% by weight.The liquid crystal polyester resin composi
6346568 Liquid crystal polyester resin composition and molded article thereof February 12, 2002
Provided is a liquid crystal polyester resin composition prepared by compounding glass fiber with a liquid crystal polyester resin, wherein said glass fiber has been surface-treated with a thermosetting resin and the ignition loss of the surface-treated glass fiber is from 0.05 to 0.4%
6231633 Granular coated fertilizer and method for producing the same May 15, 2001
Provided is a granular fertilizer coated with a thermosetting resin coating, characterized in that a dissolution rate of the fertilizer is retarded by containing a hydrophobic compound in at least one of the coating portion and the fertilizer portion thereof. The dissolution rate is
6127492 Thermoplastic resin composition and heat-resistant tray for IC October 3, 2000
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The the
5705548 Polyester powder coating composition January 6, 1998
A powder coating composition comprising as essential components: (A) polyester resin having at least two hydroxyl groups in a molecule, and (B) polyvalent organic cyanate having at least two cyanate groups in a molecule of the following formula and/or its prepolymer; ##STR1## whe
5644003 Epoxy resin composition, process for producing the same and resin-sealed semiconductor device July 1, 1997
An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp


 
 
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