| Patent Number |
Title Of Patent |
Date Issued |
| 7554780 |
Inverter system, AC rotating machine and electric power converter |
June 30, 2009 |
| In an inverter system including of an electric-power converter and an ac rotating machine, over-voltage generated in the ac rotating machine is controlled by a low-cost system configuration. The system includes: an electric-power converter; a three-phase ac rotating machine; and a fo |
| 7058305 |
Optical submarine communication system and surge suppressing apparatus of the optical submarine |
June 6, 2006 |
| An optical submarine communication system has a land cable connected to a terminal apparatus which is installed on land near the seashore for transmitting an optical signal and electric power. The land cable is connected to an optical submarine cable through a beach manhole, and a re |
| 6836006 |
Semiconductor module |
December 28, 2004 |
| In an IGBT module which contains an IGBT device and a diode device connected to each other and accommodated in a case and which radiates heat generated in operation through a radiation board, an object is to reduce the area of the module in the lateral direction to achieve size reduction |
| 6236110 |
Power semiconductor module |
May 22, 2001 |
| A current detecting sensor includes parallel flat plates opposed in a substantially U-shape in cross-section. Since the flat plates are opposed to each other, the current detecting sensor has reduced inductance, significantly decreasing frequency dependency of outputs from detection |
| 6215185 |
Power semiconductor module |
April 10, 2001 |
| An object is to obtain long-term reliability of an electric connection in a power semiconductor module. In a power semiconductor module, the main circuit interconnection directly connected to a power semiconductor chip (3) is formed of a busbar (6) and the power semiconductor chip (3) an |
| 5986218 |
Circuit board with conductor layer for increased breakdown voltage |
November 16, 1999 |
| A circuit board includes an insulating substrate having opposed first and second surfaces and a thickness; and first and second conductive layers disposed on the first and second surfaces of the insulating substrate, respectively, wherein the first conductive layer has an end surface |
