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Inventor: Mou; Chung-Shin
Address: Tu-Chen, TW
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7053472 |
Optical package structure |
May 30, 2006 |
| An optical package structure (2) includes a cover (21) defining an aperture (212) in a top portion for transmission of optical signals, a lens part (22) secured to the cover, and a base member (23) combining with the cover to define a closed space in which to package optical componen |
| 6787890 |
Optical package structure |
September 7, 2004 |
| An optical package structure (2) includes a cover (21) with a lens part (22), and a base member (23) which combines with the cover to define a closed space in which to package optical components. The base member has a bottom panel (232) and a substrate (234). A plurality of solder pads ( |
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