| Patent Number |
Title Of Patent |
Date Issued |
| 6122186 |
High power miniature demand power supply |
September 19, 2000 |
| A miniature power supply and voltage regulator containing a ceramic substrate with conductive metal bonded to the top and bottom of the substrate. The power supply contains a first device for converting alternating current to direct current, a device means for converting alternating |
| 6033764 |
Bumped substrate assembly |
March 7, 2000 |
| A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps integrally connected to the copper layer extend therefrom; the copper in the copper layer and the |
| 5608617 |
High power miniature demand power supply |
March 4, 1997 |
| A miniature power supply and voltage regulator containing a ceramic substrate with conductive metal bonded to the top and bottom of the substrate. The power supply contains a first device for converting alternating current to direct current, a device for converting alternating curren |
